TT Electronics/IRC

GS4B035760FDT

GS4B035760FDT Description

The GS4B035760FDT from TT Electronics/IRC is a high-precision 7-resistor thin film network designed for surface-mount applications. Encased in a ceramic SOIC-8 package, it offers a 576Ω resistance per element with a tight 1% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stability across a wide temperature range (70°C to 125°C). Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, this non-automotive, non-PPAP compliant component is ideal for precision circuits. Its gull-wing termination and 1.27mm pitch facilitate reliable PCB mounting, while the ceramic substrate enhances thermal performance.

GS4B035760FDT Features

• Circuit Designator: BUS configuration for streamlined integration.
• Thin Film Technology: Delivers high accuracy (±1%) and low TCR (±25ppm/°C).
• Robust Construction: Ceramic case ensures durability and heat dissipation.
• Compact Dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm).
• Surface-Mount Ready: Gull-wing leads and SOIC package simplify assembly.
• Wide Operating Range: -70°C to +125°C with derated power at elevated temperatures.
• Non-RoHS: Suitable for applications exempt from RoHS restrictions.

GS4B035760FDT Applications

This resistor network excels in:

• Precision Analog Circuits: Voltage dividers, feedback networks.
• Signal Conditioning: Sensor interfaces, ADC/DAC reference circuits.
• Industrial Electronics: PLCs, test equipment, and power management.
• Telecommunications: Impedance matching in high-frequency modules.
• Legacy Systems: Where RoHS compliance is not mandatory.

Conclusion of GS4B035760FDT

The GS4B035760FDT stands out for its exceptional stability, compact form factor, and ceramic-based reliability, making it a superior choice for precision applications demanding tight tolerances and thermal resilience. While not suited for automotive use, its thin film technology and BUS configuration offer a competitive edge in industrial and telecom systems. Engineers will appreciate its balance of performance and ease of integration, particularly in space-constrained designs.