TT Electronics/IRC

GS4B035760JGT

GS4B035760JGT Description

The GS4B035760JGT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 576Ω resistance value and ±5% absolute tolerance, this ceramic-based network ensures reliable performance in demanding environments. Its ±25ppm/°C temperature coefficient and 0.05W (1/20) power rating per resistor (0.4W total) make it suitable for circuits requiring low drift and consistent power dissipation. The SOIC-C series construction offers a compact footprint (4.9mm × 5.99mm × 1.45mm) with gull-wing terminations for secure surface mounting. Rated for 125°C maximum operating temperature and 100V maximum voltage, it meets industrial-grade requirements while being non-automotive and non-PPAP compliant.

GS4B035760JGT Features

• Ceramic substrate for enhanced thermal stability and durability.
• Thin-film technology ensures precision (±5% tolerance, ±2% ratio tolerance).
• Bussed (BUS) circuit design simplifies PCB layout for common-node applications.
• Low TCR (±25ppm/°C) minimizes resistance drift across -70°C to +125°C.
• Narrow SOIC (SOIC-8) package saves board space while enabling automated assembly.
• Gull-wing leads (1.27mm pitch) provide robust mechanical and electrical connections.
• Non-RoHS composition (contains lead) for legacy or specialized designs.

GS4B035760JGT Applications

Ideal for:

• Voltage dividers and pull-up/pull-down networks in industrial control systems.
• Signal conditioning circuits requiring matched resistance values.
• Power management modules where stable dissipation and low thermal drift are critical.
• Legacy electronics or military/aerospace systems needing non-RoHS components.
• High-density PCBs leveraging its compact SOIC footprint and bussed topology.

Conclusion of GS4B035760JGT

The GS4B035760JGT resistor network excels in precision and reliability, combining thin-film accuracy, ceramic robustness, and space-efficient packaging. Its bussed design reduces component count, while the wide temperature range and low TCR cater to harsh environments. Though unsuitable for automotive or RoHS-compliant projects, it remains a top choice for industrial, legacy, and high-performance electronics where stability and miniaturization are paramount.