


TT Electronics/IRC
GS4B035902GDT
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
GS4B035902GDT Description
GS4B035902GDT Description
The GS4B035902GDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 59KΩ resistance value and ±2% absolute tolerance, this ceramic-based network ensures reliable performance in demanding environments. Its ±25ppm/°C temperature coefficient and 0.05W (1/20) power rating per resistor (0.4W total) make it suitable for circuits operating at 70°C to 125°C derated power. The 100V maximum voltage rating and gull-wing termination enable robust surface-mount integration, while the SOIC-C series construction offers mechanical durability.
GS4B035902GDT Features
- Ceramic substrate for enhanced thermal stability and low noise.
- Thin-film technology ensures precision (±2% tolerance) and low TCR (±25ppm/°C).
- Bussed (BUS) configuration simplifies circuit design for common-node applications.
- Compact SOIC package (4.9mm × 5.99mm × 1.45mm) with tight tolerances (±0.1mm height/length).
- 1.27mm terminal pitch for compatibility with automated PCB assembly.
- Non-automotive (PPAP: No) but ideal for industrial and instrumentation use.
- Non-RoHS compliant, catering to legacy or specialized designs.
GS4B035902GDT Applications
- Voltage dividers & pull-up networks in precision analog circuits.
- Signal conditioning for sensors and data acquisition systems.
- Industrial control systems requiring stable resistance under thermal stress.
- Test & measurement equipment where ratio tolerance (±0.5%) is critical.
- Power supply feedback networks due to high voltage tolerance (100V).
Conclusion of GS4B035902GDT
The GS4B035902GDT excels in applications demanding tight tolerance, low TCR, and robust construction. Its ceramic thin-film design and bussed architecture provide superior reliability over standard thick-film networks, while the SOIC package ensures compatibility with high-density PCBs. Though not suited for automotive use, it is a cost-effective solution for industrial, medical, and precision electronics where performance stability is paramount.



.png)














.png?x-oss-process=image/format,webp/resize,h_32)










