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GS4B036041BAT
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GS4B036041BAT Description
GS4B036041BAT Description
The GS4B036041BAT from TT Electronics/IRC is a high-precision 7-resistor bussed network housed in an 8-pin narrow SOIC ceramic package. Designed for demanding applications, it features a 6.04KΩ resistance value with an exceptional ±0.1% absolute tolerance and ±0.05% ratio tolerance, ensuring minimal deviation in critical circuits. The thin-film technology delivers a low ±25ppm/°C temperature coefficient, maintaining stability across a wide operating range of -70°C to +125°C. With a 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating, this network is engineered for reliability in precision analog and digital systems.
GS4B036041BAT Features
- Ceramic SOIC Package: Robust rectangular ceramic case (4.9mm x 5.99mm x 1.45mm) with gull-wing terminations for secure surface mounting.
- High Precision: ±0.1% tolerance and ±25ppm/°C TCR for stable performance in temperature-varying environments.
- Bussed Configuration: Simplifies PCB layout by integrating 7 resistors with a common BUS connection.
- Thin-Film Technology: Delivers low noise and high accuracy, ideal for signal conditioning and voltage division.
- Derated Power Handling: Operates at 70°C to 125°C with derated power, ensuring longevity in high-temperature applications.
GS4B036041BAT Applications
This resistor network excels in:
- Precision Instrumentation: Medical devices, test equipment, and sensor interfaces requiring tight tolerance ratios.
- Automotive Electronics: Engine control units (ECUs) and ADAS systems (though not PPAP/automotive-qualified, its performance suits prototyping).
- Industrial Controls: PLCs, motor drives, and power supplies where thermal stability and low drift are critical.
- Communication Systems: RF modules and signal processing circuits benefiting from matched impedance networks.
Conclusion of GS4B036041BAT
The GS4B036041BAT stands out for its ceramic construction, precision tolerances, and bussed design, making it a superior choice for engineers prioritizing accuracy, thermal resilience, and space efficiency. While not automotive-qualified, its thin-film technology and derated power capabilities make it ideal for industrial, medical, and telecom applications where reliability is paramount. Its SOIC footprint ensures compatibility with standard SMT processes, streamlining integration into high-density PCBs.



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