TT Electronics/IRC

GS4B036192DDT

GS4B036192DDT Description

The GS4B036192DDT from TT Electronics/IRC is a high-precision 7-resistor network designed for surface-mount applications in demanding electronic circuits. Encased in a ceramic SOIC-8 package, this thin-film resistor array offers a 61.9KΩ resistance per element with an ultra-tight ±0.5% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stability across a wide operating range of -55°C to +125°C. Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, it combines reliability with compact dimensions (4.9mm × 5.99mm × 1.45mm). Its gull-wing termination and 1.27mm pitch facilitate automated PCB assembly, while the ceramic substrate enhances thermal performance.

GS4B036192DDT Features

• Precision Thin Film Technology: Delivers low noise and high accuracy (±0.5%) for sensitive analog/digital circuits.
• Robust Ceramic Construction: Superior heat dissipation and mechanical strength vs. polymer-based networks.
• BUS Circuit Designator: Optimized for bus termination, voltage division, and pull-up/down applications.
• Extended Temperature Range: Stable performance from -55°C to +125°C (derated power up to 125°C).
• Automation-Friendly: Gull-wing leads and standardized SOIC footprint streamline SMT processes.
• Non-Automotive (PPAP No): Ideal for industrial, telecom, and instrumentation use where automotive certification isn’t required.

GS4B036192DDT Applications

• Bus Termination Networks: DDR memory interfaces, CAN/LIN buses.
• Precision Voltage Dividers: ADC/DAC reference circuits, sensor signal conditioning.
• Pull-Up/Pull-Down Arrays: Microcontroller I/O ports, digital logic level setting.
• Medical/Test Equipment: High-reliability systems demanding tight tolerance and thermal stability.
• Industrial Control PCBs: PLCs, motor drives where space-efficient resistor networks are critical.

Conclusion of GS4B036192DDT

The GS4B036192DDT excels in high-density, precision applications requiring low TCR, tight tolerance, and robust thermal performance. Its ceramic SOIC package and thin-film technology make it a superior alternative to thick-film networks in environments with fluctuating temperatures or stringent accuracy needs. While not PPAP/automotive-grade, it’s a cost-effective solution for industrial, telecom, and embedded systems where reliability and miniaturization are paramount.