TT Electronics/IRC

GS4B036192JFT

GS4B036192JFT Description

The GS4B036192JFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. Encased in ceramic for enhanced thermal and mechanical stability, this network offers a 61.9KΩ resistance per element with a tight ±5% absolute tolerance and ±1% ratio tolerance, ensuring consistent performance in differential circuits. Its thin-film technology and ±25ppm/°C temperature coefficient minimize drift across the -70°C to +125°C operating range, making it suitable for harsh environments. Rated for 100V maximum voltage and 0.4W total power dissipation, it balances compactness (4.9mm × 5.99mm × 1.45mm) with robustness.

GS4B036192JFT Features

• Bussed Network Design: 7 resistors tied to a common bus, simplifying PCB layout in voltage-divider or pull-up/down configurations.
• High Stability: Ceramic substrate and thin-film construction ensure low noise and long-term reliability.
• Precision Tolerance: ±5% absolute and ±1% ratio tolerance for matched performance in differential pairs.
• Wide Temperature Range: Operates from -70°C to +125°C with derated power up to 125°C.
• Surface-Mount Gull Wing Terminals: 1.27mm pitch for compatibility with automated assembly.
• Non-Automotive, Non-PPAP: Ideal for industrial and commercial applications where PPAP compliance isn’t required.

GS4B036192JFT Applications

• Signal Conditioning: Precision voltage division in sensor interfaces or ADC/DAC circuits.
• Medical Electronics: Stable resistance networks in patient monitoring equipment.
• Test & Measurement: Calibration circuits demanding low TCR and tight tolerance matching.
• Industrial Controls: Robust performance in PLCs or motor drives exposed to temperature fluctuations.
• Communications: Impedance matching in RF modules or baseband processing.

Conclusion of GS4B036192JFT

The GS4B036192JFT excels in applications requiring high-density, precision resistance networks with excellent thermal stability. Its ceramic SOIC package and bussed architecture reduce board space while maintaining performance under stress. Though not RoHS-compliant or automotive-grade, it is a cost-effective solution for industrial, medical, and instrumentation designs where reliability and precision outweigh regulatory requirements. Engineers will appreciate its balance of tight tolerances, low TCR, and compact form factor, making it a standout choice for demanding analog circuits.