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GS4B036201CBT
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GS4B036201CBT Description
GS4B036201CBT Description
The GS4B036201CBT from TT Electronics/IRC is a high-precision 7-resistor thin film network designed for surface-mount applications. Encased in a ceramic SOIC-8 package, it offers a 6.2KΩ resistance per element with an ultra-tight ±0.25% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stability across a wide operating range (70°C to 125°C). Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, this network is engineered for reliability in demanding circuits. Its gull-wing termination and 1.27mm pitch facilitate easy PCB integration, while the ceramic substrate enhances thermal performance.
GS4B036201CBT Features
- Precision Thin Film Technology: Delivers low noise and high accuracy (±0.25%) for sensitive analog/digital systems.
- Robust Ceramic Construction: Superior thermal management vs. polymer-based arrays, ideal for high-temperature environments (up to 125°C).
- Optimized Power Handling: 0.4W total rating (1/20W per resistor) balances compact size with performance.
- BUS Configuration: Simplifies bus termination, voltage division, and pull-up/down networks in multi-channel designs.
- Stable TCR: ±25ppm/°C ensures minimal drift under thermal stress.
- Automation-Friendly Packaging: Supplied in tubes for pick-and-place efficiency.
GS4B036201CBT Applications
This resistor network excels in:
- Precision Instrumentation: ADC/DAC reference circuits, sensor signal conditioning.
- Industrial Controls: PLCs, motor drivers, and power management systems requiring stable resistance under thermal cycling.
- Communications Equipment: Termination networks for high-speed data buses (e.g., CAN, SPI).
- Medical Electronics: Patient monitoring devices where low drift and reliability are critical.
- Automotive (Non-Automotive Rated): Prototyping or non-safety-critical modules like infotainment systems.
Conclusion of GS4B036201CBT
The GS4B036201CBT stands out for its ceramic-enhanced durability, precision thin film resistors, and compact SOIC-8 footprint. While not PPAP or automotive-qualified, it is a cost-effective solution for high-accuracy, thermally challenging designs in industrial, medical, and communication systems. Its BUS topology and gull-wing terminals streamline PCB layout, making it a versatile choice for engineers prioritizing performance, space savings, and thermal resilience.



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