TT Electronics/IRC
GS4B036202DBT

50-GS4B036202DBT
PDF Datasheet
Res Thin Film NET 62K Ohm 0.5% 0.4W ±25ppm/°C BUS Ceramic 8-Pin SOIC Gull Wing SMD Tube
30 weeks

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Tech Specifications

Circuit Designator
BUS
Number of Resistors
7
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GS4B036202DBT Description

GS4B036202DBT Description

The GS4B036202DBT from TT Electronics/IRC is a high-precision 62K Ohm thin-film resistor network designed for demanding electronic applications. Packaged in an 8-pin SOIC ceramic case with gull-wing terminations, this 7-resistor array delivers 0.5% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stable performance across a -70°C to +125°C operating range. With a 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating, it is engineered for reliability in surface-mount configurations. The ceramic substrate enhances thermal stability, while the 1.27mm terminal pitch facilitates compact PCB layouts.

GS4B036202DBT Features

  • Precision Thin-Film Technology: Delivers ±0.5% tolerance and ±25ppm/°C TCR for consistent performance.
  • Robust Ceramic Construction: Ensures durability and thermal efficiency in high-temperature environments (up to 125°C).
  • Space-Efficient SOIC Package: 4.9mm × 5.99mm × 1.45mm dimensions with gull-wing leads for easy SMD assembly.
  • BUS Circuit Design: Optimized for bus termination, voltage division, and pull-up/down applications.
  • Non-Automotive Grade: Suitable for industrial, telecom, and instrumentation use (PPAP not required).

GS4B036202DBT Applications

Ideal for precision analog and digital circuits, including:

  • Bus Termination Networks: Ensures signal integrity in high-speed data lines.
  • Voltage Dividers: Provides accurate ratio matching in sensor interfaces.
  • Pull-Up/Pull-Down Arrays: Stabilizes logic levels in microcontroller systems.
  • Industrial Control Systems: Withstands harsh environments due to ceramic construction.
  • Test & Measurement Equipment: Benefits from low TCR and tight tolerance.

Conclusion of GS4B036202DBT

The GS4B036202DBT excels in applications requiring high precision, thermal stability, and compact design. Its ceramic SOIC package, thin-film technology, and BUS configuration make it a superior choice over polymer-based or less stable alternatives. While not RoHS-compliant, it remains a reliable solution for industrial and telecom systems where precision and durability are critical. Engineers will appreciate its balance of performance, size, and cost in demanding circuit designs.

FAQ

What is the standard lead time for GS4B036202DBT?
The standard lead time for GS4B036202DBT is 30 weeks.
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