TT Electronics/IRC

GS4B036650FFT

GS4B036650FFT Description

The GS4B036650FFT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC package, designed for demanding surface-mount applications. Featuring a 665Ω resistance per element with a tight ±1% absolute tolerance and ±1% ratio tolerance, this ceramic-based thin-film network ensures exceptional stability and accuracy. Its ±25ppm/°C temperature coefficient and 125°C maximum operating temperature make it suitable for environments with thermal fluctuations. The 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating further enhance its reliability in circuit designs requiring consistent performance under load.

GS4B036650FFT Features

• Ceramic SOIC-C Series Construction: Offers superior thermal and mechanical stability compared to polymer-based networks.
• Thin Film Technology: Delivers low noise and high precision, ideal for analog signal conditioning.
• Bussed Network Design: Simplifies PCB layout by reducing component count in bus line applications.
• Gull Wing Termination: Ensures robust solder joints for surface-mount assembly.
• Wide Temperature Range: Operates from 70°C to 125°C with derated power, suitable for industrial and automotive (non-AEC-Q200) use.
• Compact Dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).

GS4B036650FFT Applications

This resistor network excels in:

• Voltage Divider Circuits: Precision ratio tolerance ensures accurate signal scaling.
• Bus Line Termination: Bussed topology minimizes impedance mismatches in data/address lines.
• Industrial Control Systems: Thin-film stability suits PLCs and sensor interfaces.
• Test & Measurement Equipment: Low TCR (±25ppm/°C) maintains calibration over temperature.
• Power Supply Feedback Networks: Reliable performance in feedback loops of DC-DC converters.

Conclusion of GS4B036650FFT

The GS4B036650FFT stands out for its ceramic thin-film construction, precision tolerances, and bussed architecture, making it a robust choice for engineers prioritizing accuracy and durability. While not PPAP or automotive-qualified, its performance in industrial and instrumentation applications is unmatched. Its SOIC package ensures compatibility with automated assembly, reducing manufacturing costs. For designs requiring stable, high-density resistor networks, this model offers an optimal balance of performance and reliability.