TT Electronics/IRC

GS4B036800FFT

GS4B036800FFT Description

The GS4B036800FFT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC package, designed for demanding surface-mount applications. Built with thin-film technology on a ceramic substrate, it delivers stable performance with a ±25ppm/°C temperature coefficient and ±1% absolute tolerance. The network features a 680Ω resistance value per resistor, rated for 0.05W (1/20W) per element and 0.4W total power dissipation. Its 100V maximum voltage rating and 125°C maximum operating temperature make it suitable for industrial and automotive-adjacent environments (though not PPAP/automotive-certified). The SOIC-C series construction ensures robustness, with a compact 4.9mm × 5.99mm × 1.45mm footprint and gull-wing terminations for reliable soldering.

GS4B036800FFT Features

• Bussed topology: Simplifies PCB layout by connecting resistors in a common-node configuration.
• High stability: Ceramic case and thin-film technology minimize drift under thermal stress.
• Precision tolerances: ±1% absolute and ±1% ratio tolerance ensure consistent performance in matched circuits.
• Wide temperature range: Operates from 70°C to 125°C (derated) with minimal TCR impact.
• Space-saving: Narrow SOIC (SOIC-8) package optimizes board real estate.
• Non-RoHS (Note: Compliance may be required for certain regions).

GS4B036800FFT Applications

Ideal for precision analog and digital systems requiring matched resistances, such as:

• Voltage dividers in sensor interfaces.
• Pull-up/pull-down networks for microcontrollers and FPGAs.
• Signal conditioning in industrial PLCs and test equipment.
• Impedance matching in communication modules (limited by 100V rating).
• Legacy designs where non-RoHS compliance is acceptable.

Conclusion of GS4B036800FFT

The GS4B036800FFT excels in space-constrained, precision applications due to its low TCR, tight tolerances, and robust ceramic construction. While not suited for automotive or RoHS-mandated projects, its bussed design and SOIC compatibility streamline integration in industrial and embedded systems. Engineers will value its reliability under thermal stress and simplified routing compared to discrete resistors. For cost-sensitive or high-volume designs, verify alternative compliance requirements.