TT Electronics/IRC

GS4B036802DBT

GS4B036802DBT Description

The GS4B036802DBT from TT Electronics/IRC is a high-precision 7-resistor thin film network designed for surface-mount applications. Encased in a ceramic SOIC-8 package, it offers a 68KΩ resistance per element with an ultra-tight ±0.5% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stability across a wide operating range (70°C to 125°C). Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, it features gull-wing terminations with a 1.27mm pitch for reliable PCB mounting. Its compact dimensions (4.9mm × 5.99mm × 1.45mm) and ceramic construction provide superior thermal performance and durability.

GS4B036802DBT Features

• Precision Thin Film Technology: Delivers low noise and high accuracy (±0.5%) for critical circuits.
• Ceramic SOIC Package: Enhances heat dissipation and mechanical robustness vs. plastic alternatives.
• BUS Circuit Designator: Optimized for bus termination, voltage division, and pull-up/down applications.
• Wide Temperature Range: Stable performance from 70°C to 125°C with derated power handling.
• Automotive-Grade Alternatives: While this model is not PPAP or automotive-qualified, its ±25ppm/°C TCR rivals higher-end variants.
• Non-RoHS Compliant: Suitable for legacy or niche industrial systems with no RoHS restrictions.

GS4B036802DBT Applications

Ideal for precision analog/digital circuits requiring stable resistance networks, including:

• Bus Termination Networks: DDR memory interfaces, CAN/LIN buses.
• Voltage Dividers: Sensor signal conditioning, ADC reference circuits.
• Pull-Up/Down Arrays: Microcontroller I/O port stabilization.
• Industrial Controls: PLCs, instrumentation, and test equipment where low TCR and tight tolerance are critical.
• Aerospace & Defense: Non-RoHS compliance may align with certain legacy system requirements.

Conclusion of GS4B036802DBT

The GS4B036802DBT excels in high-reliability, precision applications where thermal stability, compactness, and electrical consistency are paramount. Its ceramic SOIC package and thin film technology offer a competitive edge over plastic-encased networks, particularly in harsh environments. While not suited for automotive use, it remains a cost-effective solution for industrial, telecom, and embedded systems demanding tight-tolerance resistor arrays. Engineers should verify RoHS compliance for regulated markets.