TT Electronics/IRC

GS4B036980FBT

GS4B036980FBT Description

The GS4B036980FBT from TT Electronics/IRC is a high-precision 7-resistor thin-film network designed for surface-mount applications. Encased in a ceramic SOIC-8 package, it offers a 698Ω resistance per element with a tight 1% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stability across a wide operating temperature range of -70°C to +125°C. Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, this network is ideal for precision analog and digital circuits. Its gull-wing termination and 1.27mm pitch facilitate reliable PCB assembly.

GS4B036980FBT Features

• Thin-Film Technology: Delivers superior accuracy and low noise compared to thick-film alternatives.
• Ceramic Case: Enhances thermal performance and mechanical durability in harsh environments.
• BUS Circuit Design: Simplifies routing in bus termination, voltage division, and pull-up/down applications.
• Compact Dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth) for space-constrained designs.
• Non-Automotive Grade: Suitable for industrial, telecom, and instrumentation use (PPAP not required).

GS4B036980FBT Applications

• Signal Conditioning: Precision attenuation or buffering in data acquisition systems.
• Bus Termination: Impedance matching for high-speed digital interfaces (e.g., SPI, I²C).
• Voltage Dividers: Stable reference networks in sensor interfaces or ADCs.
• Medical/Test Equipment: Where low TCR and high reliability are critical.

Conclusion of GS4B036980FBT

The GS4B036980FBT excels in precision analog circuits demanding stable resistance values under thermal stress. Its ceramic SOIC package and thin-film construction provide a robust solution for industrial and telecom applications, though it is not RoHS-compliant. Engineers will appreciate its tight tolerances, low TCR, and ease of integration, making it a standout choice for designs requiring repeatable performance in thermally variable environments.