TT Electronics/IRC

GS4B036980GAT

GS4B036980GAT Description

The GS4B036980GAT from TT Electronics/IRC is a high-precision 7-resistor thin-film network designed for surface-mount applications. Encased in a ceramic SOIC-8 package, it delivers a 698Ω resistance per element with a tight 2% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stability across a wide operating range of -70°C to +125°C. Rated for 0.4W total power dissipation (0.05W per resistor), it supports 100V maximum voltage and features gull-wing terminations with a 1.27mm pitch for reliable PCB mounting. Its compact dimensions (4.9mm × 5.99mm × 1.45mm) and ceramic construction enhance thermal performance and durability in demanding environments.

GS4B036980GAT Features

• Precision Thin-Film Technology: Delivers stable resistance with minimal drift (±25ppm/°C).
• Robust Ceramic Package: Superior heat dissipation and mechanical strength vs. polymer-based arrays.
• BUS Circuit Design: Optimized for bus termination, voltage division, or pull-up/down applications.
• Automation-Friendly: Gull-wing leads and 1.27mm pitch simplify pick-and-place assembly.
• Wide Temperature Range: Operates reliably from -70°C to +125°C (derated power above 70°C).
• Non-Automotive (PPAP No): Ideal for industrial, telecom, and instrumentation use.

GS4B036980GAT Applications

This resistor network excels in:

• Signal Conditioning: Precision voltage dividers in ADC/DAC circuits.
• Bus Termination: Impedance matching for high-speed digital lines (e.g., SPI, I²C).
• Industrial Controls: Stable reference resistors in PLCs or sensor interfaces.
• Power Management: Current-limiting or biasing in low-power DC/DC converters.
• Test Equipment: Calibration networks requiring low TCR and tight tolerance.

Conclusion of GS4B036980GAT

The GS4B036980GAT combines high accuracy, thermal resilience, and compact design, making it a superior choice for precision analog and digital circuits. Its ceramic SOIC package and thin-film technology outperform epoxy-based networks in harsh environments, while the BUS configuration simplifies PCB layout. Though not PPAP-qualified, it is well-suited for industrial, telecom, and test systems demanding long-term reliability. Engineers will appreciate its balance of performance, size, and cost for space-constrained, high-reliability designs.