


TT Electronics/IRC
GS4B036980GGT
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GS4B036980GGT Description
GS4B036980GGT Description
The GS4B036980GGT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC package. Designed with thin-film technology on a ceramic substrate, it delivers stable performance with a resistance value of 698Ω and a tight ±2% absolute tolerance. Its ±25ppm/°C temperature coefficient ensures minimal resistance drift across a wide operating range of -70°C to +125°C, making it suitable for demanding environments. The SOIC-C series construction provides excellent thermal and mechanical stability, while the gull-wing termination facilitates reliable surface-mount assembly. With a power rating of 0.4W (0.05W per resistor) and a maximum voltage rating of 100V, this network is ideal for precision analog and digital circuits.
GS4B036980GGT Features
- Ceramic Case & Thin Film Technology: Ensures high reliability and low noise in critical applications.
- Bussed Network (7 Resistors): Simplifies PCB layout by reducing discrete component count.
- Tight Tolerance (±2%) & Low TCR (±25ppm/°C): Delivers consistent performance under thermal stress.
- Wide Temperature Range (-70°C to +125°C): Suitable for industrial and automotive-grade designs (though not PPAP/automotive certified).
- SOIC Package (4.9mm x 5.99mm x 1.45mm): Compact footprint with 1.27mm terminal pitch for high-density boards.
- Non-RoHS Compliant: May be preferred for legacy or specific high-reliability systems.
GS4B036980GGT Applications
- Voltage Divider Networks: Precision signal conditioning in sensor interfaces.
- Pull-Up/Pull-Down Arrays: Bus termination in digital systems (e.g., I²C, SPI).
- Industrial Control Systems: Stable resistance in harsh environments (e.g., PLCs, motor drives).
- Test & Measurement Equipment: Low-drift reference networks for calibration circuits.
- Power Management Modules: Current sensing or feedback loops in DC-DC converters.
Conclusion of GS4B036980GGT
The GS4B036980GGT excels in applications demanding precision, stability, and space efficiency. Its ceramic thin-film construction and bussed design reduce assembly complexity while maintaining performance under thermal cycling. Though not RoHS-compliant or automotive-qualified, it remains a robust choice for industrial, instrumentation, and high-reliability electronics. Engineers will appreciate its balance of tolerance, power handling, and compact form factor, making it a versatile solution for analog and mixed-signal designs.



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