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GS4B037502FDT
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GS4B037502FDT Description
GS4B037502FDT Description
The GS4B037502FDT from TT Electronics/IRC is a high-precision 7-resistor thin-film network in an 8-pin SOIC package, designed for surface-mount applications. It features a 75K Ohm resistance per element with a tight 1% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stable performance across a wide -70°C to +125°C operating range. The ceramic case and gull-wing termination provide robust mechanical and thermal stability, while the 0.4W total power rating (0.05W per resistor) makes it suitable for compact, power-sensitive designs. With a 100V maximum voltage rating and ±0.1mm height/length tolerances, this network is ideal for precision analog and digital circuits.
GS4B037502FDT Features
- High Precision: 1% tolerance and ±25ppm/°C TCR for reliable signal conditioning.
- Robust Construction: Ceramic SOIC package with gull-wing leads for durability in harsh environments.
- Space-Efficient: Compact 4.9mm × 5.99mm × 1.45mm footprint optimizes PCB real estate.
- Wide Temperature Range: Operates from -70°C to +125°C with derated power up to 125°C.
- Low-Power Design: 0.05W per resistor (0.4W total) minimizes heat dissipation.
- Automation-Friendly: Tube packaging ensures compatibility with pick-and-place assembly.
GS4B037502FDT Applications
This resistor network excels in:
- Voltage Divider Networks: Precision attenuation in sensor interfaces or ADC circuits.
- Bus Termination: Stable impedance matching in high-speed digital systems (e.g., CAN, SPI).
- Industrial Electronics: Harsh-environment applications due to ceramic construction.
- Medical Devices: Low-noise, high-stability signal paths in diagnostic equipment.
- Aerospace & Defense: Reliable performance under extreme thermal cycling.
Conclusion of GS4B037502FDT
The GS4B037502FDT combines precision, durability, and compactness, making it a standout choice for engineers needing stable resistor networks in space-constrained or thermally challenging designs. Its thin-film technology and ceramic package outperform comparable thick-film or polymer-based arrays in accuracy and longevity. While not RoHS-compliant, its unconfirmed status may require validation for regulated industries. Ideal for high-reliability systems where consistent resistance matching and thermal stability are critical.



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