TT Electronics/IRC

GS4B037681JDT

GS4B037681JDT Description

The GS4B037681JDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 7.68KΩ resistance value (±5% absolute tolerance, ±0.5% ratio tolerance) and a ±25ppm/°C temperature coefficient, this ceramic-based network ensures reliable performance across a -70°C to +125°C operating range. Its 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for low-power, high-voltage circuits. The SOIC-C series construction offers robust mechanical stability, with a compact 4.9mm × 5.99mm × 1.45mm footprint and gull-wing terminations for easy surface-mount assembly.

GS4B037681JDT Features

• Bussed Network Design: 7 resistors connected in a bus configuration (Circuit Designator: BUS), simplifying PCB layout.
• Thin-Film Technology: Delivers superior stability, low noise, and tight tolerance (±5% absolute, ±0.5% ratio).
• Wide Temperature Range: Operates reliably from -70°C to +125°C with derated power up to 125°C.
• High Voltage Tolerance: Supports up to 100V, ideal for industrial and automotive (non-PPAP) applications.
• Precision Packaging: SOIC-8 case with ±0.1mm length/height and ±0.2mm depth tolerances for consistent placement.
• Non-RoHS Compliant: Suitable for legacy or specialized systems where RoHS exemptions apply.

GS4B037681JDT Applications

• Voltage Divider Networks: Precision ratio tolerance (±0.5%) ensures accurate signal conditioning.
• Industrial Control Systems: Thin-film stability and wide temperature range suit harsh environments.
• Test & Measurement Equipment: Low noise and tight tolerances enhance calibration accuracy.
• Power Management Circuits: Bussed design simplifies current-sharing applications.
• Legacy Electronics Repair: Non-RoHS compliance aligns with older system requirements.

Conclusion of GS4B037681JDT

The GS4B037681JDT resistor network combines thin-film precision, bussed topology, and robust SOIC packaging to address demanding circuit design needs. Its low TCR (±25ppm/°C), high voltage rating, and compact form factor make it a standout choice for industrial, instrumentation, and legacy systems. While not automotive-grade or PPAP-capable, its performance in stable, low-power applications is unmatched among similar networks. Engineers will appreciate its balance of accuracy, durability, and ease of integration.