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GS4B038060FDT
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GS4B038060FDT Description
GS4B038060FDT Description
The GS4B038060FDT from TT Electronics/IRC is a high-precision 7-resistor thin-film network designed for surface-mount applications. Encased in a ceramic SOIC-8 package, it offers a 806Ω resistance per element with a tight 1% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stability across a wide operating range of -70°C to +125°C. Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, this network is ideal for precision analog and digital circuits requiring reliable signal conditioning or voltage division. Its gull-wing termination and 1.27mm pitch facilitate easy PCB assembly, while the ceramic substrate enhances thermal performance and durability.
GS4B038060FDT Features
- High Precision: 1% tolerance and ±25ppm/°C TCR for stable performance in varying environments.
- Robust Construction: Ceramic case and thin-film technology ensure low noise and high reliability.
- Space-Efficient: Compact 4.9mm × 5.99mm × 1.45mm footprint with 8-pin SOIC packaging.
- Wide Temperature Range: Operates from -70°C to +125°C with derated power at elevated temperatures.
- Automated Assembly-Friendly: Gull-wing leads and standardized pitch (1.27mm) simplify SMT processes.
- Non-Automotive Grade: Suitable for industrial and commercial applications (PPAP not required).
GS4B038060FDT Applications
This resistor network excels in:
- Signal Conditioning: Precision voltage dividers in sensor interfaces or ADC/DAC circuits.
- Bus Termination: Stable impedance matching for high-speed data lines (e.g., SPI, I²C).
- Medical/Test Equipment: Low-drift performance critical for measurement accuracy.
- Power Management: Current limiting or feedback networks in DC-DC converters.
- Industrial Controls: Harsh-environment applications benefiting from ceramic durability.
Conclusion of GS4B038060FDT
The GS4B038060FDT combines precision, compactness, and thermal resilience, making it a standout choice for engineers needing reliable resistor networks in space-constrained or thermally challenging designs. While not RoHS-compliant, its ceramic construction and thin-film technology offer superior performance over polymer-based alternatives. Ideal for industrial, medical, and communication systems, this component balances cost-effectiveness with high-end specifications. For applications demanding tight tolerances and low TCR, it provides a robust, long-term solution.



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