TT Electronics/IRC

GS4B038660CT

GS4B038660CT Description

The GS4B038660CT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 8-pin narrow SOIC (SOIC-C Series) device features 7 bussed resistors with a 866Ω resistance value and an exceptional ±0.25% absolute tolerance. Built using thin-film technology, it delivers ±25ppm/°C temperature coefficient stability, ensuring reliable performance across a 70°C to 125°C operating range. The SOIC package (4.9mm × 5.99mm × 1.45mm) with gull-wing terminations enables surface-mount assembly, while its 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for compact, high-density circuits.

GS4B038660CT Features

• Precision Network: 7 bussed resistors with 866Ω ±0.25% tolerance for consistent performance.
• Stable Thin-Film Technology: ±25ppm/°C TCR ensures minimal resistance drift under thermal stress.
• Robust Ceramic Construction: SOIC-C Series case style enhances durability and heat dissipation.
• Surface-Mount Optimized: Gull-wing terminations (1.27mm pitch) facilitate automated PCB assembly.
• Wide Operating Range: Rated for -55°C to +125°C, with derated power up to 125°C.
• Compact Footprint: 4.9mm × 5.99mm × 1.45mm dimensions ideal for space-constrained designs.
• Non-Automotive: Not PPAP-capable, but suited for industrial and telecom applications.

GS4B038660CT Applications

This resistor network excels in precision analog and digital circuits, including:

• Voltage Divider Networks: High tolerance (±0.25%) ensures accurate signal conditioning.
• Sensor Interface Circuits: Low TCR (±25ppm/°C) maintains stability in temperature-variable environments.
• Medical & Test Equipment: Ceramic substrate resists moisture and mechanical stress.
• Communication Systems: Bussed design simplifies bus termination and pull-up/pull-down configurations.
• Power Management Modules: 100V rating supports mid-voltage applications.

Conclusion of GS4B038660CT

The GS4B038660CT combines precision, compactness, and thermal resilience, making it a superior choice for engineers prioritizing tolerance stability and miniaturization. While not automotive-grade, its ceramic thin-film construction and SOIC packaging offer a competitive edge in industrial, medical, and telecom sectors. For designs requiring tight resistance matching and low drift, this network delivers unmatched reliability.