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GS4B038661DAT
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GS4B038661DAT Description
GS4B038661DAT Description
The GS4B038661DAT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. This 7-resistor BUS-configuration array offers a 8.66KΩ resistance value with an ultra-tight ±0.5% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stability across a wide operating temperature range of -70°C to +125°C. Housed in a ceramic SOIC-8 package, it features gull-wing SMD terminations for reliable surface-mount assembly. With a 0.4W total power rating (0.05W per resistor) and a 100V maximum voltage rating, this network is engineered for precision analog and digital circuits where accuracy and thermal performance are critical.
GS4B038661DAT Features
- High Precision: ±0.5% tolerance and ±25ppm/°C TCR for stable performance in varying conditions.
- Robust Construction: Ceramic substrate and thin-film technology ensure durability and long-term reliability.
- Compact Design: 4.9mm x 5.99mm footprint with a low 1.45mm profile, ideal for space-constrained PCBs.
- Automotive-Grade Alternatives: While not PPAP or Automotive-qualified, its 125°C max operating temp suits industrial and telecom applications.
- Optimized Power Handling: 0.4W total dissipation (distributed across 7 resistors) mitigates thermal stress.
- Strict Dimensional Tolerances: ±0.1mm (L/W) and ±0.2mm (D) for consistent manufacturability.
GS4B038661DAT Applications
This resistor network excels in:
- Voltage Division & Signal Conditioning: Precision dividers in ADC/DAC circuits.
- Industrial Control Systems: Feedback networks for sensors and actuators requiring low drift.
- Telecom Infrastructure: Impedance matching and termination in high-frequency modules.
- Medical Electronics: Critical analog circuits where stability is non-negotiable.
- Test & Measurement Equipment: Calibration and reference circuits demanding minimal deviation.
Conclusion of GS4B038661DAT
The GS4B038661DAT stands out for its combination of precision, power efficiency, and compactness, making it a superior choice over thicker-film or less stable alternatives. Its ceramic SOIC package and thin-film technology cater to applications requiring repeatable performance under thermal stress. While not RoHS-compliant, its industrial-grade robustness and tight electrical specs justify its use in professional electronics where reliability trumps cost sensitivity. Engineers should consider this model for designs prioritizing accuracy, thermal resilience, and space savings.



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