TT Electronics/IRC

GS4B038661JDT

GS4B038661JDT Description

The GS4B038661JDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 8.66KΩ resistance per element and a ±5% absolute tolerance, this ceramic-based network ensures reliable performance in demanding environments. Its ±25ppm/°C temperature coefficient and 0.05W (1/20) power rating per resistor (0.4W total) make it suitable for circuits where thermal stability and power dissipation are critical. The SOIC-C series construction features gull-wing termination for secure surface mounting, while the 100V maximum voltage rating and 125°C operating temperature range ensure durability in industrial and automotive-adjacent applications (though not PPAP or Automotive qualified).

GS4B038661JDT Features

• Bussed Network Design: 7 resistors with a shared common terminal (BUS), simplifying PCB layout for voltage division or pull-up/down circuits.
• Thin-Film Technology: Delivers low noise and high stability (±0.5% ratio tolerance) compared to thick-film alternatives.
• Robust Construction: Ceramic case with rectangular SOIC package (4.9mm × 5.99mm × 1.45mm) and tight tolerances (±0.1mm height/length).
• Wide Temperature Range: Operates from 70°C to 125°C with derated power, ideal for thermally variable environments.
• Non-RoHS Compliant: Suitable for legacy or exempted applications requiring leaded components.

GS4B038661JDT Applications

• Voltage Dividers: Precision attenuation in sensor interfaces or ADC front-ends.
• Pull-Up/Down Networks: Signal conditioning in digital logic circuits (e.g., I²C buses).
• Industrial Control Systems: Stable resistance in PLCs or motor drivers where temperature fluctuations occur.
• Test & Measurement Equipment: Low-drift performance for calibration circuits.

Conclusion of GS4B038661JDT

The GS4B038661JDT excels in applications demanding tight tolerance ratios and thermal resilience, leveraging TT Electronics/IRC’s thin-film expertise. While not automotive-grade, its ceramic SOIC package and bussed topology offer a cost-effective solution for space-constrained, high-reliability designs. Engineers should evaluate RoHS compliance needs but can rely on its ±25ppm/°C stability and 0.4W collective power handling for critical analog or mixed-signal systems.