TT Electronics/IRC

GS4B038870FBT

GS4B038870FBT Description

The GS4B038870FBT from TT Electronics/IRC is a high-precision 7-resistor thin-film network in an 8-pin SOIC gull-wing SMD package. Designed for surface-mount applications, it features a 887Ω resistance value per resistor with a tight 1% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). The ceramic case style enhances thermal stability, while the 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for demanding circuits. Packaged in a tube, this non-automotive, non-PPAP component is ideal for precision analog and digital systems.

GS4B038870FBT Features

• Thin-film technology: Delivers high accuracy and low noise for sensitive applications.
• Ceramic construction: Ensures durability and excellent thermal management.
• BUS circuit designator: Optimized for bus termination and signal integrity.
• Gull-wing termination: Facilitates reliable surface-mount assembly.
• Compact dimensions (4.9mm x 5.99mm x 1.45mm): Saves PCB space in dense layouts.
• Wide operating temperature (-70°C to +125°C): Suitable for industrial and harsh environments.
• 1.27mm terminal pitch: Compatible with standard SOIC footprints.

GS4B038870FBT Applications

This resistor network excels in:

• Bus termination for high-speed digital interfaces (e.g., DDR, PCIe).
• Precision voltage dividers in instrumentation and measurement systems.
• Analog signal conditioning for sensors and data acquisition.
• Impedance matching in RF and communication circuits.
• Industrial control systems requiring stable, long-term performance.

Conclusion of GS4B038870FBT

The GS4B038870FBT combines high precision, robust construction, and compact design, making it a superior choice for engineers needing reliable resistor networks in signal integrity-critical applications. Its thin-film technology and ceramic case provide unmatched stability, while the SOIC package ensures compatibility with automated assembly processes. Ideal for industrial, telecom, and high-performance computing designs, this component balances performance with cost-effectiveness.