TT Electronics/IRC

GS4B038870FFT

GS4B038870FFT Description

The GS4B038870FFT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package, designed for demanding surface-mount applications. This thin-film resistor network offers a nominal resistance of 887Ω per element with a tight ±1% absolute tolerance and ±1% ratio tolerance, ensuring excellent matching accuracy. Operating within a temperature range of -70°C to +125°C, it features a low TCR of ±25ppm/°C, making it stable under thermal stress. With a power rating of 0.4W (0.05W per resistor) and a maximum voltage rating of 100V, it is engineered for reliability in precision circuits. The gull-wing termination and 1.27mm terminal pitch facilitate easy PCB integration.

GS4B038870FFT Features

• Ceramic substrate for enhanced thermal performance and durability.
• Bussed topology simplifies circuit design by interconnecting resistors.
• Thin-film technology ensures low noise and high stability.
• 1% tolerance & ±25ppm/°C TCR for precision applications.
• SOIC package (4.9mm x 5.99mm x 1.45mm) with tight dimensional tolerances (±0.1mm height/length).
• RoHS non-compliant (suitable for legacy or exempted applications).
• Tube packaging for automated assembly compatibility.

GS4B038870FFT Applications

Ideal for precision voltage dividers, analog signal conditioning, and feedback networks in:

• Industrial control systems requiring stable resistance under thermal cycling.
• Medical instrumentation where accuracy and low drift are critical.
• Telecommunications equipment leveraging its low-noise characteristics.
• Automotive test/development systems (though not PPAP/AEC-Q200 qualified).
• Legacy military/aerospace electronics benefiting from ceramic robustness.

Conclusion of GS4B038870FFT

The GS4B038870FFT excels in precision analog circuits where tight tolerance, thermal stability, and compact form factor are paramount. Its ceramic construction and thin-film technology provide superior performance over polymer-based networks, while the bussed design reduces PCB complexity. Though not automotive-grade, it is a cost-effective solution for industrial, medical, and telecom applications demanding high reliability. Engineers will appreciate its balance of accuracy, power handling, and ease of integration in space-constrained designs.