TT Electronics/IRC

GS4B039090FT

GS4B039090FT Description

The GS4B039090FT by TT Electronics/IRC is a high-performance 7-resistor bussed network designed for precision applications. Housed in an 8-pin narrow SOIC ceramic package, it features a 909Ω resistance value with a tight ±1% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stability across a wide operating range of 70°C to 125°C. Its thin-film technology delivers superior accuracy and reliability, while the 0.05W (1/20) power rating per resistor and 0.4W total power rating make it suitable for low-power circuits. The 100V maximum voltage rating and gull-wing termination enable robust surface-mount integration in space-constrained designs.

GS4B039090FT Features

• Ceramic SOIC-C case for enhanced thermal and mechanical durability.
• Bussed (BUS) circuit design simplifies layout in voltage-divider or pull-up/down networks.
• Precision thin-film resistors with ±1% tolerance and ±25ppm/°C TCR for minimal drift.
• Compact dimensions (4.9mm x 5.99mm x 1.45mm) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• 8-pin gull-wing termination for reliable PCB mounting and solderability.
• Non-automotive (PPAP No) but ideal for industrial and telecom applications.

GS4B039090FT Applications

• Voltage division/reference circuits in precision analog systems.
• Pull-up/down networks for digital logic interfaces (e.g., I²C, SPI).
• Signal conditioning in sensor arrays and measurement equipment.
• Embedded systems requiring stable, space-efficient resistor networks.
• Power management modules where low TCR and high accuracy are critical.

Conclusion of GS4B039090FT

The GS4B039090FT excels in high-accuracy, low-power applications demanding stable performance under thermal stress. Its ceramic construction, bussed design, and thin-film technology offer distinct advantages over polymer-based or discrete alternatives, particularly in precision analog and mixed-signal environments. While not RoHS-compliant, it remains a robust choice for industrial and telecom designs where reliability and miniaturization are paramount.