TT Electronics/IRC

GS7B011620FT

GS7B011620FT Description

The GS7B011620FT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 14-pin narrow SOIC package features 13 bussed resistors with a 162Ω resistance value and a tight ±1% tolerance, ensuring reliable signal integrity in demanding circuits. Built with thin-film technology, it delivers excellent stability with a ±100ppm/°C temperature coefficient and operates within a 70°C to 125°C derated power range, making it suitable for environments requiring thermal resilience. The SOIC-C series construction offers a compact footprint (8.66mm × 5.99mm × 1.45mm) with gull-wing terminations for easy surface-mount assembly. Rated for 100V maximum voltage and 0.7W total power dissipation, it balances efficiency with durability.

GS7B011620FT Features

• 13 bussed resistors in a 14-pin SOIC package, ideal for bus line termination.
• Thin-film ceramic substrate ensures low noise and high stability.
• Precision tolerance (±1%) and ±100ppm/°C TCR for consistent performance.
• Wide operating temperature range (-55°C to +125°C) with derating up to 125°C.
• Surface-mount gull-wing terminals with 1.27mm pitch for automated PCB assembly.
• Non-automotive and non-PPAP compliant, suited for industrial/consumer electronics.
• Non-RoHS compliant, catering to legacy or specialized applications.

GS7B011620FT Applications

This resistor network excels in:

• Voltage divider networks and pull-up/pull-down circuits in digital systems.
• Bus termination for memory modules (e.g., DDR, SDRAM) to reduce signal reflection.
• Precision analog circuits requiring stable resistance under thermal stress.
• Industrial control systems where ceramic durability and thin-film accuracy are critical.
• Legacy equipment maintenance due to its non-RoHS compliance.

Conclusion of GS7B011620FT

The GS7B011620FT stands out for its robust ceramic construction, tight tolerance, and thermal stability, making it a reliable choice for high-precision and high-temperature applications. While not suited for automotive use, its bussed design and SOIC footprint optimize space and performance in industrial, digital, and legacy systems. Engineers will appreciate its balance of power handling (0.7W total) and miniaturized form factor, ideal for densely packed PCBs.