TT Electronics/IRC

GS7B011740FCT

GS7B011740FCT Description

The GS7B011740FCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 14-pin narrow SOIC device features 13 bussed resistors with a 174Ω resistance value, offering an absolute tolerance of ±1% and an exceptional ratio tolerance of ±0.25%. Built with thin-film technology, it ensures stable performance across a wide temperature range (70°C to 125°C) and delivers a power rating of 0.7W (0.05W per resistor). The SOIC package with gull-wing termination enables reliable surface-mount assembly, while its ceramic case provides superior thermal and mechanical durability.

GS7B011740FCT Features

• High Precision: ±1% absolute tolerance and ±0.25% ratio tolerance for matched resistance performance.
• Robust Construction: Ceramic case ensures thermal stability and mechanical strength.
• Wide Operating Range: Rated for -55°C to +125°C, with derated power up to 125°C.
• Low TCR: ±100ppm/°C temperature coefficient minimizes resistance drift.
• Compact Design: 8.66mm × 5.99mm × 1.45mm dimensions with tight tolerances (±0.1mm height/length).
• High Voltage Rating: Supports up to 100V, suitable for industrial and automotive-grade circuits.
• Bussed Configuration: Simplifies PCB layout in bus-line applications.

GS7B011740FCT Applications

This resistor network is ideal for:

• Precision voltage dividers in instrumentation and measurement systems.
• Signal conditioning circuits in industrial automation and control modules.
• Bus termination networks for high-speed digital interfaces (e.g., CAN, SPI).
• Analog front-end designs requiring matched resistance (e.g., sensor bridges, op-amp feedback).
• Automotive electronics (non-PPAP compliant, but suitable for prototyping and non-safety-critical systems).

Conclusion of GS7B011740FCT

The GS7B011740FCT excels in precision, thermal stability, and compact integration, making it a superior choice for high-reliability applications. Its ceramic construction, tight tolerances, and bussed architecture provide distinct advantages over polymer-based or discrete alternatives. While not PPAP-certified, it remains a cost-effective solution for industrial, telecom, and embedded systems demanding consistent performance under thermal stress. Engineers will appreciate its balance of accuracy, power handling, and space efficiency in densely packed PCB designs.