TT Electronics/IRC

GS7B011742FBT

GS7B011742FBT Description

The GS7B011742FBT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Packaged in a 14-pin narrow SOIC (SOIC-C series), it features 13 bussed resistors with a 17.4KΩ resistance value and a tight ±1% absolute tolerance, ensuring reliable signal integrity. The thin-film technology delivers ±100ppm/°C temperature coefficient, making it stable across a wide temperature range (70°C to 125°C). With a power rating of 0.7W (0.05W per resistor) and 100V maximum voltage rating, this network is engineered for durability in demanding circuits. Its gull-wing termination and surface-mount design facilitate easy PCB integration, while the ceramic case ensures robust thermal and mechanical performance.

GS7B011742FBT Features

• Precision Network: 13 bussed resistors with ±1% tolerance and ±0.1% ratio tolerance for consistent performance.
• High-Temperature Stability: Operates reliably from 70°C to 125°C with a low ±100ppm/°C TCR.
• Robust Construction: Ceramic SOIC package (8.66mm x 5.99mm x 1.45mm) with ±0.1mm height tolerance for mechanical resilience.
• Surface-Mount Ready: Gull-wing terminals and 1.27mm pitch for seamless PCB assembly.
• Power Efficiency: 0.7W total power dissipation (0.05W per resistor) optimizes energy use in compact designs.
• Non-Automotive: Suitable for industrial and commercial applications where PPAP compliance is not required.

GS7B011742FBT Applications

• Signal Conditioning: Ideal for ADC/DAC circuits requiring stable voltage division.
• Voltage Division Networks: Precision bussing in test equipment and instrumentation.
• Industrial Controls: Reliable performance in PLC modules and sensor interfaces.
• Consumer Electronics: Compact footprint for audio/video processing and power management.
• Telecom Infrastructure: High-voltage tolerance suits line drivers and communication modules.

Conclusion of GS7B011742FBT

The GS7B011742FBT stands out for its precision, thermal stability, and compact SOIC packaging, making it a superior choice for applications demanding tight tolerance and durability. While not RoHS-compliant or automotive-grade, its ceramic thin-film design and bussed architecture excel in industrial, telecom, and high-precision electronic systems. Engineers will appreciate its ease of integration and consistent performance under varying thermal conditions.