TT Electronics/IRC

GS7B011961FBT

GS7B011961FBT Description

The GS7B011961FBT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Part of the SOIC-C Series, this 14-pin narrow SOIC package integrates 13 bussed resistors with a 1.96KΩ resistance value and a tight ±1% absolute tolerance. Its thin-film technology ensures stable performance, with a low ±100ppm/°C temperature coefficient, making it suitable for environments with fluctuating temperatures. The device operates within a 70°C to 125°C derated power range, with a maximum operating temperature of 125°C and a 100V maximum voltage rating. The 0.05W (1/20) power rating per resistor and 0.7W total power rating provide reliable power dissipation in compact designs.

GS7B011961FBT Features

• Ceramic Construction: Ensures durability and thermal stability in harsh conditions.
• Bussed Network Design: Simplifies circuit layout with interconnected resistors.
• Precision Tolerance: ±1% absolute and ±0.1% ratio tolerance for high-accuracy applications.
• Surface-Mount Gull Wing Termination: Facilitates easy PCB assembly with a 1.27mm terminal pitch.
• Compact SOIC Package: Measures 8.66mm (L) x 5.99mm (D) x 1.45mm (H) with tight tolerances (±0.1mm L/H, ±0.2mm D).
• Wide Temperature Range: Reliable performance from -55°C to 125°C.
• Non-Automotive, Non-PPAP: Ideal for industrial and commercial uses.

GS7B011961FBT Applications

This resistor network excels in precision analog and digital circuits, including:

• Voltage Divider Networks: Ensures consistent signal conditioning.
• Sensor Interface Circuits: Maintains accuracy in temperature-sensitive environments.
• Medical Electronics: Reliable performance in diagnostic equipment.
• Industrial Control Systems: Stable operation in high-temperature settings.
• Communication Devices: Low-noise signal processing in RF and baseband applications.

Conclusion of GS7B011961FBT

The GS7B011961FBT stands out for its ceramic thin-film construction, precision tolerances, and compact SOIC footprint, making it a robust choice for high-reliability applications. While not automotive-grade, its thermal stability and low TCR make it ideal for industrial, medical, and communication systems requiring consistent performance under varying conditions. Its bussed design reduces component count, simplifying PCB layouts without compromising accuracy.