TT Electronics/IRC

GS7B012002JGT

GS7B012002JGT Description

The GS7B012002JGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in a 14-pin narrow SOIC package, it features 13 bussed resistors with a 20KΩ resistance value and a ±5% absolute tolerance. Its thin-film technology ensures stable performance, supported by a ±100ppm/°C temperature coefficient. The device operates within a wide temperature range of 70°C to 125°C and offers a maximum voltage rating of 100V, making it suitable for demanding environments. With a power rating of 0.7W (0.05W per resistor), it balances efficiency and reliability. The gull-wing termination and surface-mount design facilitate easy integration into compact PCB layouts.

GS7B012002JGT Features

• Robust Construction: Ceramic case ensures durability and thermal stability.
• Precision Engineering: Thin-film resistors deliver ±2% ratio tolerance for matched performance.
• High Power Handling: 0.7W total power dissipation (0.05W per resistor) at 125°C maximum operating temperature.
• Space-Efficient: Compact SOIC package (8.66mm × 5.99mm × 1.45mm) with ±0.1mm length/height tolerances.
• Wide Compatibility: EAR99 ECCN and HTS 8533.21.00.20 classification for global use.
• Stable Performance: Low TCR (±100ppm/°C) ensures minimal resistance drift.

GS7B012002JGT Applications

Ideal for precision analog circuits, voltage dividers, and signal conditioning in:

• Industrial Control Systems: Stable performance in harsh environments.
• Medical Electronics: Reliable operation in diagnostic equipment.
• Automotive Modules: Non-automotive grade but suitable for ancillary systems.
• Test & Measurement Equipment: High accuracy for calibration circuits.
• Communication Devices: Impedance matching in RF applications.

Conclusion of GS7B012002JGT

The GS7B012002JGT stands out for its ceramic-based reliability, tight tolerance, and thermal resilience, making it a superior choice for precision networks. While not PPAP or automotive-grade, its thin-film technology and bussed design cater to industrial and medical applications requiring long-term stability. Its compact SOIC footprint and high power-handling capability further enhance its versatility in space-constrained, high-performance designs.