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GS7B012432BT
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GS7B012432BT Description
GS7B012432BT Description
The GS7B012432BT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding applications requiring tight tolerance and stable performance. Housed in a 14-pin narrow SOIC package, this bussed network integrates 13 thin-film resistors, each with a 24.3KΩ resistance and an exceptional ±0.1% absolute tolerance. The device operates over a wide temperature range of 70°C to 125°C with a derated power capability, ensuring reliability in thermally challenging environments. Its ±100ppm/°C temperature coefficient and 100V maximum voltage rating make it suitable for precision analog and digital circuits. The SOIC-C series construction features a rectangular ceramic case with gull-wing terminations, optimized for surface-mount assembly.
GS7B012432BT Features
- High Precision: ±0.1% tolerance and ±100ppm/°C TCR ensure minimal drift.
- Robust Construction: Ceramic substrate enhances thermal stability and mechanical durability.
- Space-Efficient: Compact 8.66mm × 5.99mm × 1.45mm footprint with 1.27mm terminal pitch.
- Power Handling: 0.7W total power dissipation (0.05W per resistor).
- Bussed Design: Simplified PCB layout for common bus applications.
- Wide Operating Range: Rated for 125°C maximum temperature, derated up to 70°C.
- Non-Automotive: Ideal for industrial and instrumentation use (PPAP not required).
GS7B012432BT Applications
This resistor network excels in:
- Precision voltage dividers and reference circuits in test equipment.
- Signal conditioning for ADCs/DACs in data acquisition systems.
- Impedance matching in high-frequency communication devices.
- Industrial control systems requiring stable resistance under thermal stress.
- Medical electronics where tight tolerance and reliability are critical.
Conclusion of GS7B012432BT
The GS7B012432BT stands out for its ceramic thin-film technology, offering superior accuracy and thermal performance compared to polymer-based networks. Its bussed architecture reduces component count in bus-driven designs, while the SOIC package ensures compatibility with automated assembly processes. Though not RoHS-compliant, it remains a top choice for non-consumer applications demanding precision and durability. Engineers will value its low TCR, high power density, and industry-proven reliability in harsh operational environments.



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