TT Electronics/IRC

GS7B012610FFT

GS7B012610FFT Description

The GS7B012610FFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications requiring stable resistance values under varying thermal conditions. Packaged in a 14-pin narrow SOIC (SOIC-C) format, this bussed network integrates 13 thin-film resistors, each with a 261Ω resistance and a tight ±1% absolute tolerance. Its ±100ppm/°C temperature coefficient ensures minimal resistance drift across the operating range of -55°C to +125°C, making it suitable for environments with fluctuating temperatures. The device offers a 0.7W total power rating (0.05W per resistor) and supports 100V maximum voltage, housed in a compact 8.66mm × 5.99mm × 1.45mm ceramic case with gull-wing terminations for reliable surface mounting.

GS7B012610FFT Features

• Ceramic Construction: Enhances thermal stability and durability in harsh conditions.
• Thin-Film Technology: Delivers precision resistance with low noise and high reliability.
• Bussed Network Design: Simplifies PCB layout by reducing discrete component count.
• Wide Temperature Range: Operates from -55°C to +125°C with derated power up to 125°C.
• 1% Tolerance: Ensures consistent performance in precision circuits.
• SOIC Package: Compatible with automated assembly processes; 1.27mm terminal pitch for dense layouts.
• Non-Automotive (PPAP No): Ideal for industrial and commercial applications.

GS7B012610FFT Applications

This resistor network excels in:

• Voltage Divider Circuits: Due to its matched tolerance (±1%) and low TCR.
• Signal Conditioning: For sensors, ADCs, and DACs requiring stable reference resistances.
• Power Management Systems: Where derated power handling up to 125°C is critical.
• Industrial Control Modules: Benefiting from ceramic packaging’s vibration resistance.
• Test & Measurement Equipment: Demanding precision and repeatability.

Conclusion of GS7B012610FFT

The GS7B012610FFT stands out for its ceramic substrate, thin-film accuracy, and robust SOIC packaging, offering superior thermal and electrical stability compared to polymer-based networks. While non-compliant with EU RoHS, its 1% tolerance and bussed architecture make it a cost-effective solution for space-constrained, high-reliability designs in industrial and instrumentation sectors. Engineers prioritizing long-term stability and minimal drift will find this model particularly advantageous.