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GS7B012612DT
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GS7B012612DT Description
GS7B012612DT Description
The GS7B012612DT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 14-pin narrow SOIC package, this bussed (BUS) configuration integrates 13 thin-film resistors, each with a 26.1kΩ resistance and an absolute tolerance of ±0.5%. The device operates over a wide temperature range of 70°C to 125°C with a derated power capability, ensuring reliability in thermally challenging environments. Its ±100ppm/°C temperature coefficient and 100V maximum voltage rating make it suitable for precision analog and digital circuits. The SOIC-C series construction features a rectangular ceramic case with gull-wing terminations, optimized for surface-mount (SMD) assembly.
GS7B012612DT Features
- High Precision: Tight ±0.5% tolerance and ±100ppm/°C TCR ensure stable performance in precision applications.
- Robust Construction: Ceramic substrate enhances thermal stability and durability.
- Space-Efficient: Compact 8.66mm × 5.99mm × 1.45mm footprint with 1.27mm terminal pitch for high-density PCB layouts.
- Power Handling: 0.7W total power rating (0.05W per resistor) supports moderate power dissipation.
- Automated Assembly Friendly: Gull-wing leads and tube packaging streamline pick-and-place processes.
- Wide Operating Range: Rated for -55°C to +125°C, with derated performance up to 125°C.
GS7B012612DT Applications
- Analog Signal Conditioning: Ideal for voltage dividers, feedback networks, and sensor interfaces in industrial controls.
- Medical Electronics: Suitable for precision instrumentation due to low drift and high stability.
- Telecommunications: Used in filtering and impedance-matching circuits for RF/mixed-signal PCBs.
- Automotive (Non-Automotive Rated): Auxiliary systems requiring robust, temperature-resistant passive networks.
- Test & Measurement Equipment: Calibration circuits and reference networks benefit from its tight tolerances.
Conclusion of GS7B012612DT
The GS7B012612DT excels in applications demanding high precision, thermal resilience, and compact integration. Its ceramic thin-film technology and bussed architecture offer superior performance compared to epoxy-based networks, particularly in environments with fluctuating temperatures. While not PPAP or automotive-qualified, it remains a cost-effective solution for industrial, medical, and telecom designs. Engineers will appreciate its balance of accuracy, power handling, and SMD compatibility, making it a versatile choice for modern electronics.



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