TT Electronics/IRC

GS7B013161DT

GS7B013161DT Description

The GS7B013161DT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 14-pin narrow SOIC package, this bussed (BUS) network integrates 13 thin-film resistors with a 3.16KΩ resistance value and an exceptional ±0.5% absolute tolerance. Its ±100ppm/°C temperature coefficient ensures stable performance across a wide operating temperature range of 70°C to 125°C. The device features a 0.05W (1/20) power rating per resistor and a total power rating of 0.7W, making it suitable for low-power, high-density circuits. With a 100V maximum voltage rating and gull-wing termination, it is optimized for surface-mount (SMT) assembly. The ceramic case provides superior thermal and mechanical stability, while the SOIC package (8.66mm x 5.99mm x 1.45mm) ensures compatibility with automated PCB manufacturing.

GS7B013161DT Features

• Precision Tolerance: ±0.5% absolute tolerance for critical analog/digital signal conditioning.
• Thermal Stability: ±100ppm/°C TCR minimizes resistance drift in varying environments.
• Robust Construction: Ceramic substrate enhances durability and heat dissipation.
• High-Density Design: 13 resistors in a compact SOIC-14 package (1.27mm pitch).
• Wide Voltage Range: Supports up to 100V, ideal for industrial and automotive subsystems (non-AECQ qualified).
• Surface-Mount Ready: Gull-wing terminals facilitate reliable SMT soldering.
• Non-RoHS Compliant: Suitable for legacy or specialized applications requiring leaded components.

GS7B013161DT Applications

• Voltage Divider Networks: Precision attenuation in sensor interfaces or ADC/DAC circuits.
• Bus Termination: Signal integrity in high-speed digital systems (e.g., memory buses).
• Industrial Controls: Stable resistance in PLCs, motor drives, and power management PCBs.
• Test & Measurement Equipment: Calibration and reference circuits due to low tolerance drift.
• Aerospace & Defense: Non-RoHS compliance aligns with certain military specifications.

Conclusion of GS7B013161DT

The GS7B013161DT excels in applications requiring tight tolerance, thermal resilience, and space efficiency. Its ceramic thin-film technology and bussed architecture offer superior performance over polymer-based networks, particularly in high-temperature or precision-critical environments. While not PPAP or automotive-grade, it is a cost-effective solution for industrial, telecom, and legacy systems. Engineers will value its balance of precision, power handling, and compact form factor, making it a versatile choice for modern PCB designs.