TT Electronics/IRC

GS7B0131R6GFT

GS7B0131R6GFT Description

The GS7B0131R6GFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Packaged in a 14-pin narrow SOIC (SOIC-C series), this bussed network integrates 13 thin-film resistors with a 31.6Ω resistance value and a tight ±2% absolute tolerance (±1% ratio tolerance). Its ±100ppm/°C temperature coefficient ensures stable performance across a wide operating range of -70°C to +125°C, making it suitable for environments with thermal fluctuations. The device offers a 0.7W total power rating (0.05W per resistor) and supports 100V maximum voltage, housed in a compact 8.66mm × 5.99mm × 1.45mm ceramic package with gull-wing terminations for reliable surface-mount assembly.

GS7B0131R6GFT Features

• High-Density Integration: 13 resistors in a space-saving SOIC-14 package, reducing PCB footprint.
• Robust Construction: Ceramic substrate enhances thermal stability and durability under high-stress conditions.
• Precision Performance: ±2% tolerance and ±100ppm/°C TCR ensure consistent signal integrity in analog/digital systems.
• Wide Voltage Range: Supports up to 100V, ideal for industrial and automotive (non-AECQ) applications.
• Optimized Thermal Management: Derated power up to 125°C prevents overheating in compact designs.
• EU RoHS Non-Compliant: Suitable for legacy systems requiring specific material properties.

GS7B0131R6GFT Applications

• Signal Conditioning: Precision voltage dividers and pull-up/down networks in data acquisition systems.
• Industrial Controls: Embedded in PLC modules and sensor interfaces for noise-resistant operation.
• Telecom Infrastructure: Used in line termination circuits and impedance matching for high-frequency PCBs.
• Test & Measurement Equipment: Provides stable reference resistances in calibration instruments.
• Power Management: Distributed resistor networks in DC-DC converter feedback loops.

Conclusion of GS7B0131R6GFT

The GS7B0131R6GFT excels in high-reliability applications where space, thermal resilience, and electrical precision are critical. Its ceramic thin-film technology and bussed architecture offer superior performance over polymer-based networks, particularly in industrial and telecom systems. While not automotive-grade, its wide temperature range and low TCR make it a versatile choice for engineers prioritizing longevity and accuracy in harsh environments. For designs requiring tight-tolerance, multi-resistor integration, this network delivers an optimal balance of compactness and functionality.