TT Electronics/IRC

GS7B0133R0JGT

GS7B0133R0JGT Description

The GS7B0133R0JGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Packaged in a 14-pin narrow SOIC (SOIC-C series), this bussed network integrates 13 resistors, each with a 33Ω resistance and a ±5% absolute tolerance (±2% ratio tolerance). Built with thin-film technology, it delivers stable performance with a ±100ppm/°C temperature coefficient, ensuring reliability across a wide operating range of -55°C to +125°C. The 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for low-power, high-voltage environments. Its gull-wing termination and surface-mount design facilitate easy PCB integration.

GS7B0133R0JGT Features

• Robust Construction: Ceramic case ensures durability and thermal stability.
• Precision Performance: Thin-film resistors with ±100ppm/°C TCR for minimal drift.
• Space-Efficient: Compact 8.66mm × 5.99mm × 1.45mm footprint (SOIC package).
• High Voltage Tolerance: Supports up to 100V, ideal for industrial applications.
• Bussed Configuration: Simplifies circuit design by connecting multiple resistors to a common node.
• Strict Tolerances: ±5% absolute and ±2% ratio tolerance for consistent performance.
• Wide Temperature Range: Operates from -55°C to +125°C with derated power up to 125°C.

GS7B0133R0JGT Applications

• Analog Signal Conditioning: Precision voltage dividers in sensor interfaces.
• Industrial Control Systems: Robust performance in PLCs and motor drives.
• Power Management: Current-limiting and pull-up/pull-down networks in power supplies.
• Automotive Electronics: Non-automotive grade but suitable for benign environments.
• Test & Measurement Equipment: Stable resistance for calibration circuits.

Conclusion of GS7B0133R0JGT

The GS7B0133R0JGT excels in applications requiring high-density, precision resistor networks with low thermal drift and high voltage tolerance. Its ceramic construction and thin-film technology provide superior reliability compared to standard thick-film networks, while the bussed design reduces PCB complexity. Though not PPAP or automotive-qualified, it is ideal for industrial, telecom, and instrumentation systems where stability and compactness are critical. Engineers will appreciate its balance of performance, size, and cost-effectiveness.