TT Electronics/IRC_GS7B0133R2FDT
original

TT Electronics/IRC
GS7B0133R2FDT

50-GS7B0133R2FDT
PDF Datasheet
Ceramic Resistor Network, SOIC-C Series,14-Pin Narrow SOIC, Bussed elements,±100ppm/°C, 33.2Ohm, absolute tolerance ±1%, ratio tolerance ±0.5%
30 weeks

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Tech Specifications

Circuit Designator
BUS
Number of Resistors
13
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GS7B0133R2FDT Description

GS7B0133R2FDT Description

The GS7B0133R2FDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 14-pin narrow SOIC device features 13 bussed resistors with a 33.2Ω resistance value and a tight ±1% absolute tolerance, ensuring consistent performance. Built with thin-film technology, it offers excellent stability with a ±100ppm/°C temperature coefficient, making it suitable for environments with fluctuating temperatures. The SOIC package (8.66mm × 5.99mm × 1.45mm) is optimized for surface-mount assembly, with gull-wing terminations for reliable PCB connections. Rated for 100V maximum voltage and 0.7W total power dissipation, it operates reliably within a 70°C to 125°C derated power range, peaking at 125°C maximum operating temperature.

GS7B0133R2FDT Features

  • Ceramic substrate for enhanced thermal and mechanical stability.
  • Bussed network topology simplifies circuit design by interconnecting resistors.
  • 1% tolerance and ±0.5% ratio tolerance for precision voltage division or current limiting.
  • Thin-film construction ensures low noise and high accuracy.
  • 0.05W (1/20W) power rating per resistor with 0.7W total power handling.
  • Gull-wing termination for robust SMT compatibility.
  • Narrow SOIC (SOIC-C) package saves board space while maintaining durability.
  • Non-automotive, non-PPAP compliant, ideal for industrial and commercial applications.

GS7B0133R2FDT Applications

This resistor network excels in:

  • Analog signal conditioning circuits requiring stable resistance ratios.
  • Voltage dividers in sensor interfaces or ADC front-ends.
  • Bus termination for digital communication lines (e.g., SPI, I²C).
  • Power supply feedback networks where precision and thermal stability are critical.
  • Industrial control systems demanding reliable performance under thermal stress.

Conclusion of GS7B0133R2FDT

The GS7B0133R2FDT stands out for its ceramic-based thin-film design, offering superior thermal performance and precision in a compact SOIC package. Its bussed architecture reduces component count, while 1% tolerance and low TCR ensure long-term reliability. Although not RoHS-compliant, it is a cost-effective solution for industrial, instrumentation, and communication systems where accuracy and durability are paramount. For engineers seeking a robust, space-saving resistor network, this model delivers exceptional value.

FAQ

What is the standard lead time for GS7B0133R2FDT?
The standard lead time for GS7B0133R2FDT is 30 weeks.
What package or case is GS7B0133R2FDT available in?
Are there related or alternative parts for GS7B0133R2FDT?
What voltage specification is listed for GS7B0133R2FDT?
What operating temperature range does GS7B0133R2FDT support?
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