TT Electronics/IRC

GS7B013482JT

GS7B013482JT Description

The GS7B013482JT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Housed in a 14-pin narrow SOIC package, this bussed (BUS) configuration network integrates 13 thin-film resistors, each with a 34.8KΩ resistance and a ±5% tolerance. The device operates over a wide temperature range of -70°C to +125°C, with a derated power capability up to 125°C, ensuring reliability in harsh environments. Its ±100ppm/°C temperature coefficient and 100V maximum voltage rating make it suitable for stable, low-drift applications. The SOIC-C series construction features a rectangular ceramic case with gull-wing terminations, optimized for surface-mount (SMD) assembly.

GS7B013482JT Features

• Robust Construction: Ceramic substrate enhances thermal stability and mechanical durability.
• Precision Performance: Thin-film technology delivers low noise and high accuracy (±5% tolerance).
• High-Density Integration: 13 resistors in a compact 8.66mm × 5.99mm footprint, saving PCB space.
• Wide Operating Range: Supports -70°C to +125°C with 0.05W (1/20W) power rating per resistor (0.7W total).
• Automated Assembly Friendly: 1.27mm terminal pitch and gull-wing leads ensure compatibility with pick-and-place systems.
• Non-Automotive Grade: Ideal for industrial, telecom, and instrumentation applications where PPAP compliance is not required.

GS7B013482JT Applications

This resistor network excels in:

• Signal Conditioning: Voltage dividers, pull-up/pull-down networks in ADC/DAC circuits.
• Industrial Controls: Precision feedback loops in PLC modules and sensor interfaces.
• Telecom Infrastructure: Impedance matching in RF front-end circuits and baseband processing.
• Test & Measurement Equipment: Stable reference networks in oscilloscopes and multimeters.
• Power Management: Auxiliary circuits in DC-DC converters requiring tight tolerance.

Conclusion of GS7B013482JT

The GS7B013482JT stands out for its ceramic-based reliability, tight electrical tolerances, and compact SOIC packaging, making it a superior choice over plastic-encased alternatives. Its bussed architecture simplifies design in multi-channel systems, while the thin-film technology ensures long-term stability. While not RoHS-compliant, it remains a cost-effective solution for non-consumer applications demanding rugged performance. Engineers will appreciate its balance of precision, power handling, and space efficiency in critical circuit designs.