
TT Electronics/IRC
GS7B0134R0JGT
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GS7B0134R0JGT Description
GS7B0134R0JGT Description
The GS7B0134R0JGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. This 14-pin narrow SOIC package integrates 13 bussed resistors with a 34Ω resistance value, offering a ±5% absolute tolerance and ±2% ratio tolerance. Built with thin-film technology, it ensures stable performance across a wide temperature range (70°C to 125°C) and features a ±100ppm/°C temperature coefficient. The SOIC-C series construction provides excellent thermal and mechanical stability, making it ideal for compact, high-density PCB designs.
GS7B0134R0JGT Features
- Ceramic substrate for superior thermal management and durability.
- Bussed network topology simplifies circuit design by connecting multiple resistors in a single package.
- Low power rating (0.05W per resistor, 0.7W total) ensures efficient operation in low-power applications.
- Gull-wing termination enables reliable surface-mount (SMD) assembly with a 1.27mm terminal pitch.
- High voltage rating (100V) and wide operating temperature range (-55°C to +125°C) suit harsh environments.
- Non-compliant with EU RoHS, making it suitable for legacy or specialized industrial systems.
GS7B0134R0JGT Applications
This resistor network excels in:
- Analog signal conditioning and voltage division in precision measurement equipment.
- Bus termination and pull-up/pull-down networks in digital communication systems (e.g., I²C, SPI).
- Industrial control systems requiring stable resistance under thermal stress.
- Automotive test fixtures (though not PPAP/AEC-Q200 qualified) due to its rugged ceramic construction.
- Medical devices where consistent performance and miniaturization are critical.
Conclusion of GS7B0134R0JGT
The GS7B0134R0JGT stands out for its combination of precision, compactness, and thermal resilience, making it a versatile choice for engineers designing high-reliability electronics. Its bussed architecture reduces component count, while the ceramic SOIC package ensures longevity in challenging conditions. While not RoHS-compliant, it remains a robust solution for legacy or niche applications demanding tight tolerance and stable thin-film performance.



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