TT Electronics/IRC

GS7B013741JAT

GS7B013741JAT Description

The GS7B013741JAT from TT Electronics/IRC is a high-performance 14-pin narrow SOIC ceramic resistor network, designed for precision applications requiring stable resistance values in compact surface-mount packages. This bussed (BUS) configuration integrates 13 thin-film resistors, each rated at 3.74KΩ with ±5% absolute tolerance and an exceptional ±0.05% ratio tolerance, ensuring consistent performance in differential signal processing. The network operates over a wide temperature range of 70°C to 125°C with a ±100ppm/°C temperature coefficient, making it suitable for environments with thermal fluctuations. Encased in a rectangular ceramic SOIC package, it offers robust mechanical stability and efficient heat dissipation.

GS7B013741JAT Features

• Precision Thin-Film Technology: Delivers low noise and high stability for sensitive circuits.
• Bussed Design: Simplifies PCB layout by connecting multiple resistors to a common node.
• High Power Handling: 0.7W total power rating (0.05W per resistor) at 100V maximum voltage.
• Compact & Robust: 8.66mm × 5.99mm × 1.45mm dimensions with ±0.1mm length/height tolerances for tight PCB integration.
• Automotive-Grade Alternatives: While not PPAP-certified, its 125°C max operating temperature suits industrial and telecom applications.
• Gull Wing Termination: Ensures reliable surface-mount soldering with 1.27mm pitch.

GS7B013741JAT Applications

Ideal for:

• Voltage Divider Networks: Precision ratio tolerance (±0.05%) ensures accurate signal scaling.
• Industrial Control Systems: Stable performance in harsh environments (e.g., motor drives, PLCs).
• Telecommunications: Low-noise thin-film resistors for RF and analog signal conditioning.
• Test & Measurement Equipment: High tolerance and thermal stability critical for calibration circuits.
• Power Management: Bussed configuration simplifies bias networks in DC-DC converters.

Conclusion of GS7B013741JAT

The GS7B013741JAT excels in applications demanding precision, thermal resilience, and space efficiency. Its ceramic SOIC package, bussed architecture, and tight tolerances provide a competitive edge over polymer-based networks, particularly in high-reliability systems. While not RoHS-compliant or automotive-rated, it remains a cost-effective solution for industrial and telecom designs requiring robust performance. Engineers should evaluate its derating above 70°C and non-EU compliance for region-specific projects.