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GS7B013742FFT
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GS7B013742FFT Description
GS7B013742FFT Description
The GS7B013742FFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in a 14-pin narrow SOIC package, this bussed network integrates 13 resistors with a 37.4KΩ resistance value and a tight ±1% absolute tolerance. Its thin-film technology ensures stable performance across a wide temperature range (70°C to 125°C), with a low ±100ppm/°C temperature coefficient. The SOIC-C series construction offers 0.7W total power dissipation (0.05W per resistor) and a 100V maximum voltage rating, making it suitable for demanding circuits. The ceramic case and gull-wing termination enhance durability and solderability in surface-mount applications.
GS7B013742FFT Features
- 13 bussed resistors in a 14-pin SOIC package for compact PCB layouts.
- Ceramic substrate ensures high thermal stability and reliability.
- Thin-film technology delivers precision (±1% tolerance) and low TCR (±100ppm/°C).
- 0.7W total power rating (0.05W per resistor) with derating up to 125°C.
- 100V maximum voltage rating and 1.27mm terminal pitch for high-density designs.
- RoHS non-compliant, ideal for legacy or industrial systems without RoHS restrictions.
- Tube packaging for automated assembly processes.
GS7B013742FFT Applications
This resistor network excels in:
- Analog signal conditioning (e.g., voltage dividers, sensor interfaces).
- Bus termination and pull-up/pull-down networks in digital systems.
- Industrial control systems requiring stable resistance under thermal stress.
- Automotive electronics (non-automotive grade) for non-safety-critical circuits.
- Test and measurement equipment where precision and repeatability are critical.
Conclusion of GS7B013742FFT
The GS7B013742FFT stands out for its ceramic-based durability, thin-film accuracy, and bussed design flexibility. While not PPAP or automotive-qualified, its wide temperature range and high voltage tolerance make it a robust choice for industrial, telecom, and instrumentation applications. Its SOIC footprint and 1.27mm pitch ensure compatibility with standard SMT processes, offering a reliable solution for space-constrained, high-performance designs.



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