TT Electronics/IRC

GS7B014701FDT

GS7B014701FDT Description

The GS7B014701FDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications requiring stable resistance values and compact packaging. This 14-pin Narrow SOIC device features 13 bussed resistors with a 4.7KΩ resistance value, offering an absolute tolerance of ±1% and a ratio tolerance of ±0.5%. Built with thin-film technology, it ensures low noise and high reliability, making it ideal for signal conditioning, voltage division, and impedance matching in demanding environments. The SOIC-C series package provides excellent thermal stability, with a temperature coefficient of ±100ppm/°C and a power rating of 0.7W (0.05W per resistor).

GS7B014701FDT Features

• Ceramic substrate for superior thermal and mechanical stability.
• Bussed network topology simplifies circuit design by connecting multiple resistors in a single package.
• Thin-film technology ensures precision (±1% tolerance) and low parasitic effects.
• Wide temperature range of -55°C to +125°C (derated power up to 125°C).
• Gull-wing termination for reliable surface-mount assembly (SMD).
• Compact dimensions: 8.66mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm).
• Non-automotive grade (PPAP: No) but suitable for industrial and telecom applications.
• 100V maximum voltage rating and 1.27mm terminal pitch for high-density PCB layouts.

GS7B014701FDT Applications

This resistor network excels in:

• Precision analog circuits: Voltage dividers, DAC/ADC interfaces.
• Industrial control systems: Signal conditioning, feedback networks.
• Telecommunications: Impedance matching, line termination.
• Test & measurement equipment: Calibration circuits, reference networks.
• Power management: Current sensing, load sharing.

Conclusion of GS7B014701FDT

The GS7B014701FDT combines high precision, compact packaging, and robust ceramic construction, making it a standout choice for engineers seeking reliability in tight-tolerance applications. Its bussed design reduces component count, while thin-film technology ensures consistent performance across temperature fluctuations. While not RoHS-compliant, it remains a cost-effective solution for industrial and telecom systems where precision and durability are critical.