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GS7B014752JT
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GS7B014752JT Description
GS7B014752JT Description
The GS7B014752JT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 14-pin narrow SOIC package features 13 bussed resistors with a 47.5KΩ resistance value and a ±5% tolerance, ensuring reliable performance in voltage division and bus termination applications. Built with thin-film technology, it offers a ±100ppm/°C temperature coefficient, maintaining stability across a wide operating range of -70°C to +125°C. The SOIC-C series construction provides robust mechanical and thermal characteristics, making it suitable for industrial and commercial environments.
GS7B014752JT Features
- Ceramic substrate for enhanced thermal and mechanical durability.
- Bussed network topology simplifies circuit design for bus applications.
- Low TCR (±100ppm/°C) ensures minimal resistance drift under temperature fluctuations.
- High power rating (0.7W total, 0.05W per resistor) supports energy-efficient designs.
- Gull-wing termination for reliable surface-mount (SMD) assembly.
- Narrow SOIC (8.66mm × 5.99mm × 1.45mm) footprint saves PCB space.
- 100V maximum voltage rating for robust signal handling.
- Non-automotive grade with PPAP "No", ideal for non-critical industrial use.
GS7B014752JT Applications
This resistor network excels in:
- Voltage dividers and pull-up/pull-down networks in digital systems.
- Bus termination for SPI, I²C, or other serial communication interfaces.
- Signal conditioning in test & measurement equipment.
- Industrial control systems requiring stable resistance under thermal stress.
- Consumer electronics where space-efficient, high-density resistor arrays are needed.
Conclusion of GS7B014752JT
The GS7B014752JT combines precision, durability, and compact design, making it a versatile choice for engineers seeking reliable resistor networks. Its ceramic construction, tight tolerance, and low TCR outperform plastic-encased alternatives in harsh environments. While not RoHS-compliant, it remains a cost-effective solution for non-automotive applications demanding stable performance. Ideal for PCB designs requiring space optimization and thermal resilience, this component bridges the gap between performance and practicality.



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