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GS7B015111GFT
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GS7B015111GFT Description
GS7B015111GFT Description
The GS7B015111GFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 14-pin narrow SOIC package features 13 bussed resistors with a 5.11KΩ resistance value and a tight ±2% absolute tolerance, ensuring consistent performance. Built with thin-film technology, it offers excellent stability with a ±100ppm/°C temperature coefficient, making it suitable for environments with fluctuating temperatures. The device operates within a -70°C to +125°C range and delivers a 0.7W total power rating (0.05W per resistor), with a 100V maximum voltage rating. Its gull-wing termination and surface-mount design facilitate easy integration into compact PCB layouts.
GS7B015111GFT Features
- Ceramic Case & Thin Film Technology: Ensures high reliability and thermal stability.
- Bussed Network (13 Resistors): Simplifies circuit design for common bus applications.
- Precision Tolerance: ±2% absolute, ±1% ratio tolerance for accurate signal conditioning.
- Wide Temperature Range: Operates from -70°C to +125°C with derated power up to 125°C.
- Compact SOIC Package: 8.66mm (L) × 5.99mm (D) × 1.45mm (H) with tight dimensional tolerances (±0.1mm).
- Low TCR (±100ppm/°C): Minimizes resistance drift under thermal stress.
- Gull-Wing Termination: Ensures robust solder joints for surface-mount assembly.
GS7B015111GFT Applications
This resistor network is ideal for:
- Voltage Divider Networks: Precision dividers in analog signal processing.
- Bus Termination: Stabilizing data lines in communication systems (e.g., CAN, I2C).
- Sensor Interface Circuits: High-accuracy signal conditioning for industrial sensors.
- Power Management: Load sharing or current limiting in distributed power systems.
- Automotive & Industrial Electronics: Despite non-automotive PPAP status, its rugged ceramic construction suits harsh environments.
Conclusion of GS7B015111GFT
The GS7B015111GFT stands out for its ceramic encapsulation, thin-film precision, and bussed architecture, offering superior performance in space-constrained, high-reliability applications. While not PPAP-certified, its wide temperature range, low TCR, and robust package make it a versatile choice for industrial, telecom, and instrumentation designs requiring stable, repeatable resistance networks. Engineers will appreciate its balance of compactness, power handling, and tolerance precision, reducing BOM complexity in bus-oriented circuits.



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