TT Electronics/IRC

GS7B015360FDT

GS7B015360FDT Description

The GS7B015360FDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Packaged in a 14-pin narrow SOIC (SOIC-C) format, it features 13 bussed resistors with a 536Ω resistance value and a tight ±1% absolute tolerance. The thin-film technology ensures low noise and high stability, while the ±100ppm/°C temperature coefficient guarantees reliable performance across a wide operating range of -55°C to +125°C. With a 0.7W total power rating (0.05W per resistor) and 100V maximum voltage rating, this network is ideal for space-constrained designs requiring robust thermal and electrical characteristics.

GS7B015360FDT Features

• Ceramic substrate for superior thermal management and durability.
• Bussed circuit design simplifies PCB layout and reduces component count.
• Thin-film technology delivers ±0.5% ratio tolerance for matched resistance pairs.
• Gull-wing termination ensures reliable surface-mount (SMD) assembly.
• Compact dimensions: 8.66mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm).
• Non-automotive grade (PPAP: No) but suitable for industrial and telecom applications.
• Non-RoHS compliant, making it suitable for legacy or specialized systems.

GS7B015360FDT Applications

This resistor network excels in:

• Precision analog circuits (e.g., voltage dividers, sensor interfaces).
• Signal conditioning in test/measurement equipment.
• Power supply feedback networks requiring stable resistance ratios.
• Industrial control systems where ceramic construction resists harsh environments.
• Legacy electronics needing non-RoHS components.

Conclusion of GS7B015360FDT

The GS7B015360FDT stands out for its ceramic-based reliability, tight tolerances, and bussed architecture, reducing design complexity. While not suited for automotive use, its high-temperature stability and low TCR make it a top choice for precision industrial and telecom applications. Engineers will appreciate its balance of performance and compactness, particularly in space-sensitive designs.