TT Electronics/IRC

GS7B015601CT

GS7B015601CT Description

The GS7B015601CT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 14-pin narrow SOIC package, this bussed (BUS) configuration network integrates 13 thin-film resistors, each with a 5.6KΩ resistance and an exceptional ±0.25% tolerance. The device operates over a wide temperature range of -70°C to +125°C, with a derated power range up to 125°C, ensuring reliability in harsh environments. Its ±100ppm/°C temperature coefficient and 100V maximum voltage rating make it suitable for precision analog and digital circuits. The SOIC-C series construction features a rectangular ceramic case with gull-wing terminations, optimized for surface-mount (SMD) assembly.

GS7B015601CT Features

• High Precision: ±0.25% absolute tolerance and ±100ppm/°C TCR for stable performance.
• Robust Construction: Ceramic substrate ensures thermal stability and low parasitic effects.
• Power Efficiency: 0.05W (1/20W) per resistor with a total power rating of 0.7W.
• Compact Design: 8.66mm length × 5.99mm depth × 1.45mm height, ideal for space-constrained PCBs.
• Automated Assembly Friendly: 1.27mm terminal pitch and gull-wing leads for reliable SMT placement.
• Wide Operating Range: Supports -70°C to +125°C, derated up to 125°C.
• Non-Automotive: Not PPAP-capable, but suited for industrial and telecom applications.

GS7B015601CT Applications

This resistor network excels in:

• Precision voltage dividers and signal conditioning circuits.
• Analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) requiring matched resistances.
• Industrial control systems where temperature stability is critical.
• Telecommunication infrastructure, such as line drivers and impedance matching networks.
• Test and measurement equipment demanding low drift and high accuracy.

Conclusion of GS7B015601CT

The GS7B015601CT stands out for its ceramic thin-film technology, tight tolerances, and thermal resilience, making it a superior choice for precision applications. While not automotive-grade, its SOIC package and bussed architecture simplify PCB layout in industrial and telecom designs. Engineers will appreciate its balance of performance, size, and reliability, particularly in environments where component consistency and longevity are paramount.