TT Electronics/IRC

GS7B015622FT

GS7B015622FT Description

The GS7B015622FT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding surface-mount applications. Housed in a 14-pin narrow SOIC package, this bussed (BUS) configuration network integrates 13 thin-film resistors, each with a 56.2KΩ resistance and a tight ±1% tolerance. The device operates over a wide temperature range of -70°C to +125°C, with a derated power capability up to 125°C, ensuring reliability in harsh environments. Its ±100ppm/°C temperature coefficient and 100V maximum voltage rating make it suitable for precision analog and digital circuits. The SOIC-C series construction features a rectangular ceramic case with gull-wing terminations, optimized for automated PCB assembly.

GS7B015622FT Features

• High-Density Integration: 13 resistors in a compact 8.66mm × 5.99mm × 1.45mm SOIC package, saving board space.
• Robust Performance: 0.05W (1/20) power rating per resistor and 0.7W total power dissipation, with excellent thermal stability.
• Precision Engineering: ±1% absolute tolerance and thin-film technology ensure consistent performance in precision circuits.
• Automation-Friendly: 1.27mm terminal pitch and surface-mount design streamline high-volume manufacturing.
• Non-Automotive Grade: Ideal for industrial and consumer electronics, though not PPAP or automotive qualified.

GS7B015622FT Applications

This resistor network excels in:

• Voltage Division & Pull-Up/Down Circuits: Bussed topology simplifies bus line termination in microcontrollers and FPGAs.
• Signal Conditioning: Low TCR (±100ppm/°C) minimizes drift in sensor interfaces and ADC/DAC circuits.
• Power Management: Stable performance in DC-DC converter feedback networks and load-sharing systems.
• Test & Measurement Equipment: High accuracy and ceramic durability suit calibration tools and precision instrumentation.

Conclusion of GS7B015622FT

The GS7B015622FT combines space efficiency, precision, and thermal resilience, making it a standout choice for industrial controls, telecom hardware, and embedded systems. While not RoHS-compliant, its ceramic construction and thin-film technology offer superior stability over polymer-based alternatives. Engineers will appreciate its balance of density, power handling, and tolerance—critical for designs requiring repeatable performance under thermal stress.