TT Electronics/IRC

GS7B015901JFT

GS7B015901JFT Description

The GS7B015901JFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. Housed in a 14-pin narrow SOIC package, this bussed network features 13 thin-film resistors with a 5.9KΩ resistance value and a ±5% absolute tolerance. Its ±100ppm/°C temperature coefficient ensures stable performance across a wide temperature range (70°C to 125°C). The device offers a power rating of 0.7W (0.05W per resistor) and supports a maximum voltage rating of 100V, making it suitable for high-reliability circuits. With gull-wing termination and surface-mount compatibility, it integrates seamlessly into compact PCB designs.

GS7B015901JFT Features

• Robust Construction: Ceramic case ensures durability and thermal stability.
• Precision Performance: Thin-film technology delivers low TCR (±100ppm/°C) and tight ratio tolerance (±1%).
• High Power Handling: 0.7W total dissipation (0.05W per resistor) at derated temperatures.
• Compact Design: 8.66mm × 5.99mm × 1.45mm dimensions with ±0.1mm length/height tolerances.
• Automated Assembly Friendly: Gull-wing leads and 1.27mm terminal pitch simplify SMT processes.
• Wide Operating Range: Rated for -55°C to +125°C, ideal for industrial and automotive (non-PPAP) applications.

GS7B015901JFT Applications

• Voltage Divider Networks: Precision signal conditioning in sensor interfaces.
• Bus Termination: Stable impedance matching in high-speed digital circuits (e.g., CAN, SPI).
• Industrial Controls: Reliable performance in PLCs, motor drives, and power supplies.
• Test & Measurement Equipment: Low-drift resistance paths for calibration circuits.
• Aerospace & Defense: Non-RoHS compliant variant suits legacy systems requiring ceramic robustness.

Conclusion of GS7B015901JFT

The GS7B015901JFT excels in environments demanding thermal stability, precision, and compactness. Its ceramic SOIC package and thin-film resistors provide superior reliability over polymer-based networks, while the bussed architecture simplifies circuit design. Though not PPAP-capable, it remains a cost-effective choice for industrial, instrumentation, and high-temperature applications where consistent performance is critical. Engineers will appreciate its balance of power handling, tolerance accuracy, and space-saving form factor.