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GS7B0160R4GT
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GS7B0160R4GT Description
GS7B0160R4GT Description
The GS7B0160R4GT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. This 14-pin narrow SOIC package features 13 bussed resistors with a 60.4Ω resistance value and a tight ±2% absolute tolerance. Built using thin-film technology, it delivers excellent stability with a ±100ppm/°C temperature coefficient, ensuring reliable performance across a wide temperature range of -70°C to +125°C. The SOIC-C series construction offers a compact footprint (8.66mm x 5.99mm x 1.45mm) with gull-wing termination, making it ideal for surface-mount applications. With a maximum voltage rating of 100V and a power rating of 0.7W (0.05W per resistor), this network is engineered for efficiency and durability in circuit designs requiring multiple matched resistors.
GS7B0160R4GT Features
- High-Density Integration: Combines 13 resistors in a 14-pin SOIC package, saving PCB space.
- Precision Performance: ±2% tolerance and ±100ppm/°C TCR ensure consistent operation under thermal stress.
- Robust Construction: Ceramic substrate enhances thermal and mechanical stability.
- Wide Operating Range: Rated for -70°C to +125°C, suitable for industrial and automotive (non-PPAP) environments.
- Optimized Power Handling: 0.7W total power dissipation (0.05W per resistor) balances load distribution.
- Surface-Mount Ready: Gull-wing leads and 1.27mm pitch simplify automated assembly.
GS7B0160R4GT Applications
This resistor network excels in:
- Voltage Division Circuits: Precision dividers in sensor interfaces or ADCs.
- Bus Termination: Effective for impedance matching in high-speed digital systems.
- Industrial Control Systems: Stable performance in PLCs, motor drives, and power supplies.
- Test & Measurement Equipment: Low-drift resistance networks for calibration.
- Consumer Electronics: Space-constrained designs needing reliable passive arrays.
Conclusion of GS7B0160R4GT
The GS7B0160R4GT stands out for its compact design, precision, and ruggedness, making it a superior choice for engineers prioritizing density, thermal resilience, and repeatability. While not RoHS-compliant, its ceramic thin-film technology and bussed architecture offer distinct advantages in harsh or high-reliability applications. Ideal for signal conditioning, termination, and analog circuits, this network bridges the gap between performance and miniaturization in modern electronics.



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