TT Electronics/IRC

GS7B016191GFT

GS7B016191GFT Description

The GS7B016191GFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 14-pin narrow SOIC package features 13 bussed resistors with a 6.19KΩ resistance value and a tight ±2% absolute tolerance, ensuring reliable performance in demanding circuits. Built with thin-film technology, it offers excellent stability with a ±100ppm/°C temperature coefficient, making it suitable for environments with fluctuating thermal conditions. The SOIC-C series construction provides robust mechanical integrity, while the gull-wing termination ensures secure surface mounting. With a power rating of 0.7W (0.05W per resistor) and a maximum operating temperature of 125°C, this network is engineered for durability and efficiency.

GS7B016191GFT Features

• Ceramic case for enhanced thermal and mechanical stability.
• Bussed circuit design simplifies routing in bus-oriented applications.
• Thin-film technology delivers low noise and high precision (±2% tolerance, ±1% ratio tolerance).
• Wide temperature range (70°C to 125°C derated) with ±100ppm/°C thermal performance.
• Compact SOIC package (8.66mm x 5.99mm x 1.45mm) with ±0.1mm dimensional tolerances.
• 100V maximum voltage rating and 1.27mm terminal pitch for high-density PCB layouts.
• Non-automotive and non-PPAP compliant, ideal for industrial and commercial use.

GS7B016191GFT Applications

This resistor network excels in:

• Voltage division and bus termination in digital communication systems.
• Precision analog circuits requiring stable resistance ratios (e.g., sensor interfaces, ADCs).
• Power management modules where derated power handling (up to 125°C) is critical.
• Embedded systems leveraging its compact SOIC footprint for space-constrained designs.
• Industrial control boards demanding reliable thin-film performance under thermal stress.

Conclusion of GS7B016191GFT

The GS7B016191GFT stands out for its ceramic-based robustness, precision thin-film resistors, and optimized SOIC packaging, making it a superior choice for engineers prioritizing stability and miniaturization. While not RoHS-compliant, its high-temperature resilience and low TCR make it ideal for industrial and instrumentation applications where consistent performance is paramount. For designs requiring bussed networks with tight tolerances, this model offers a compelling blend of reliability and technical refinement.