TT Electronics/IRC

GS7B016200FDT

GS7B016200FDT Description

The GS7B016200FDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Housed in a 14-pin narrow SOIC package, this bussed network integrates 13 thin-film resistors, each with a 620Ω resistance value and a tight ±1% absolute tolerance. Its ±100ppm/°C temperature coefficient ensures stable performance across a wide operating temperature range of -70°C to +125°C. The device features gull-wing terminations for reliable surface-mount assembly and is packaged in a tube for automated handling. With a 0.7W total power rating (0.05W per resistor) and 100V maximum voltage rating, it is engineered for efficiency in compact designs.

GS7B016200FDT Features

• Ceramic SOIC-C Series Construction: Ensures durability and thermal stability in harsh environments.
• Bussed Network (BUS): Simplifies circuit design by interconnecting resistors, reducing component count.
• Precision Thin-Film Technology: Delivers ±1% tolerance and ±0.5% ratio tolerance for critical analog/digital applications.
• Wide Temperature Range: Operates reliably from -70°C to +125°C with derated power up to 125°C.
• Low TCR (±100ppm/°C): Minimizes resistance drift under thermal stress.
• Compact Footprint: 8.66mm (L) × 5.99mm (D) × 1.45mm (H) with tight dimensional tolerances (±0.1mm height/length).
• Automation-Friendly: Gull-wing leads and 1.27mm pitch enable high-speed PCB assembly.

GS7B016200FDT Applications

Ideal for precision circuitry where space and reliability are paramount, including:

• Voltage Dividers & Pull-Up Networks: In ADCs, DACs, and microcontroller I/O interfaces.
• Sensor Signal Conditioning: For industrial/automotive sensors requiring stable bias networks.
• Medical Electronics: Patient monitoring devices demanding low drift and high accuracy.
• Aerospace & Defense Systems: Ruggedized electronics needing ceramic-packaged components.
• Power Management ICs: Auxiliary circuits in DC-DC converters or LDO regulators.

Conclusion of GS7B016200FDT

The GS7B016200FDT stands out for its ceramic-based robustness, precision thin-film resistors, and bussed architecture, making it a superior choice over plastic-encapsulated networks in high-reliability applications. Its combination of tight tolerances, low TCR, and compact SOIC footprint addresses challenges in miniaturized, thermally dynamic designs. While not PPAP or automotive-qualified, it excels in industrial, medical, and aerospace sectors where ceramic packages and stable performance are critical. Engineers seeking a high-density, high-stability resistor network will find this model a compelling solution.