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GS7B016492GFT
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GS7B016492GFT Description
GS7B016492GFT Description
The GS7B016492GFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. Housed in a 14-pin narrow SOIC package, this bussed network integrates 13 thin-film resistors with a 64.9KΩ resistance value and a tight ±2% absolute tolerance. Its ±100ppm/°C temperature coefficient ensures stable performance across a wide operating temperature range of 70°C to 125°C. The device features gull-wing terminations for reliable surface-mount assembly and is packaged in a tube for automated handling. With a 0.7W total power rating (0.05W per resistor) and 100V maximum voltage rating, it is engineered for efficiency and durability in compact designs.
GS7B016492GFT Features
- Ceramic SOIC-C Series: Robust construction with rectangular package (8.66mm x 5.99mm x 1.45mm) and tight dimensional tolerances (±0.1mm height/length).
- Thin-Film Technology: Delivers low noise and high accuracy, ideal for precision circuits.
- Bussed Configuration: Simplifies PCB layout by connecting resistors in a common bus topology.
- Wide Temperature Range: Operates reliably from 70°C to 125°C with derated power.
- Automation-Friendly: Gull-wing terminations and 1.27mm pitch enable high-speed SMT assembly.
- Non-Automotive/Non-PPAP: Suitable for industrial and commercial applications where PPAP compliance is not required.
GS7B016492GFT Applications
This resistor network excels in:
- Signal Conditioning: Precision voltage dividers and pull-up/pull-down networks in data acquisition systems.
- Industrial Controls: Embedded in PLC modules and sensor interfaces due to its stability under thermal stress.
- Test & Measurement Equipment: Used in calibration circuits where ratio tolerance (±1%) is critical.
- Power Management: Distributed load sharing in low-power DC/DC converters.
- Telecom Infrastructure: Reliable performance in filter networks and impedance matching.
Conclusion of GS7B016492GFT
The GS7B016492GFT combines high-density integration, thermal resilience, and precision thin-film technology, making it a standout choice for engineers designing compact, high-reliability systems. Its bussed architecture reduces component count, while ceramic construction ensures longevity in harsh environments. While not RoHS-compliant, it remains a cost-effective solution for industrial, telecom, and instrumentation applications where precision and durability are paramount.



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